In the process of PCB design and manufacturing, batch chamfering of traces is an important step that helps to enhance the electrical performance and mechanical strength of PCBs, while also facilitating operations during production and assembly.We need to pay attention to some key points of batch chamfering of PCB traces:
01
Purpose of Chamfering
• Avoid 90° traces to reduce impedance discontinuities, especially in high-speed signal designs.
• Increase the adhesion of PCB copper foil to improve product reliability.
02
Types of Chamfers
Rounded corners: Complex design, usually used for high-speed signal traces, with better impedance consistency, suitable for circuits above GHz.
Chamfer: Simple design, turning right angles or sharp angles into two 45° angles, used in conventional high-speed signal circuits.
03
Software Operations
In PCB design software, such as Vxin Mars PCB, batch chamfering can be completed using the Fillet command.
04
Quality Control
• After chamfering is completed, quality checks are needed to ensure that the angles and dimensions of the chamfers meet design requirements, with no short or open circuit issues.
• Automatic Optical Inspection (AOI) is a common inspection method that can detect whether the chamfers have been correctly implemented.
05
Design Considerations
• During the design phase, designers need to consider the impact of chamfering on trace length and impedance, as well as the effect of chamfering on the overall layout of the PCB.
• Chamfering can also enhance the aesthetics of the PCB and facilitate assembly, for example, edges of connectors need to be chamfered to ensure a tight fit.
Batch chamfering of PCB traces is a complex process involving design, manufacturing, and quality control, requiring precise operations and strict quality assurance.
What is the Impact of Chamfering on Signal Integrity?
Reducing Signal Reflection
Right-angle traces cause sudden changes in characteristic impedance, leading to signal reflection. Chamfering can reduce this reflection by minimizing the abrupt changes in trace width, thereby improving signal integrity.
Reducing Electromagnetic Interference (EMI)
Right-angle traces may produce unnecessary radiation, while chamfering can reduce this radiation, thereby lowering EMI. This is particularly important for high-frequency signals, as they are more susceptible to radiation and interference.
Reducing Transmission Delay
Right-angle traces increase additional parasitic capacitance, affecting signal transmission speed. Chamfering helps to reduce this parasitic capacitance, thereby decreasing transmission delay.
Improving Mechanical Strength
Copper foil at right angles is prone to detaching from the PCB substrate; chamfering can mitigate this risk, enhancing the mechanical strength and reliability of the PCB.
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