The RK3588 core board is a widely used 8K flagship SoC chip from Rockchip, and it is one of the domestic chips frequently used by many electronic engineers. When using the RK3588, EMC issues often arise. So, how can we reduce these EMC problems?
1. Mold Isolation Design
Connectors should be recessed as much as possible within the housing to increase the distance for static electricity to reach the internal circuits, thereby weakening the energy;
This design changes the testing standard from contact discharge conditions to air discharge, effectively reducing the impact of static electricity on internal circuits.
2. PCB Layout Optimization
When laying out the PCB, ensure the protection and isolation of sensitive components such as RF, audio, and storage, which can all have shielding added;
Place the RK3588 chip and core components as close to the center of the PCB as possible. If this is not feasible, ensure that the shielding is at least 2MM away from the edge of the board and that it can be reliably grounded;
Layout the PCB according to functional modules and signal flow, ensuring that sensitive parts are independent from each other, and isolate areas prone to interference, such as DC-DC.
3. Shielding Application
Use shielding to protect sensitive modules, ensuring stable operation in complex electromagnetic environments;
The design of the shielding must consider heat dissipation and grounding to ensure good electromagnetic shielding effectiveness.
4. Electrical Characteristics Consideration
When designing the circuit board, in addition to achieving functional requirements, also consider electrical characteristics such as EMI, EMC, and ESD to ensure the reliability of the entire system.
5. Three-Proof Design
For industrial-grade three-proof tablet computers and other devices based on the RK3588 chip, adopt waterproof, dustproof, and shockproof designs to ensure stable and durable operation in harsh industrial environments.
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