The new silicon-based fans are 96% smaller than non-silicon-based active cooling alternatives.
xMEMs Lab has announced the launch of an unprecedented new chip. It is small, much smaller than typical cooling alternatives, allowing for the creation of smaller smartphones, laptops, and other consumer devices.
One of the key challenges in designing portable devices is maximizing computing power while minimizing size. This is especially important as the significance of AI increases, as AI computations require processors capable of effectively handling large amounts of calculations.
Various cooling solutions have been implemented to reduce the heat generated by processors. However, they also require space, limiting the potential for manufacturing smaller devices.
xMEMs Labs claims that its silicon-based chip, the XMC-2400, utilizes the company’s audio speaker technology to significantly save space compared to current cooling solution alternatives.
The design of the XMC-2400 μCooling chip resembles a miniature solid-state fan. The chip uses a silicon-based vibrating structure to push air, thereby cooling the components.
The dimensions of the XMC-2400 are 9.26 x 7.6 x 1.08 mm, weighing less than 150 mg. The company claims it is 96% smaller and lighter than non-silicon-based active cooling alternatives.
The individual XMC-2400 chip has an IP58 rating and can move up to 39 cubic centimeters of air per second at a back pressure of 1,000Pa.
“The thermal management of super mobile devices is beginning to run more processor-intensive AI applications, which is a huge challenge for manufacturers and consumers,” said Joseph, CEO and co-founder of xMEMS, in a statement.
xMEMS plans to demonstrate the chip to customers at live events in Shenzhen and Taipei in September, with samples of the XMC-2400 expected to be available to customers in the first quarter of 2025.
Source: cybernews