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Sensors, as one of the three pillars of the modern information industry, are key components of automated monitoring and intelligent control systems, known as the “eyes of the Internet of Things.” With the rapid development of emerging technologies such as Industry 4.0, the Internet of Things, and intelligent manufacturing, the importance of sensor technology has become increasingly prominent. However, China still faces many technical bottlenecks in the sensor field that urgently need to be overcome.
Intelligent Fiber Optic Sensors: The “Weapon” for Monitoring Aircraft Engines
Intelligent fiber optic sensors are mainly used for monitoring the status of aircraft engines and heavy gas turbines, capable of real-time measurement of parameters such as pressure, temperature, vibration, strain, displacement, and exhaust gas composition during engine operation, providing data support for the operational status, health status, and fault analysis of engines/gas turbines. International industrial giants such as GE, Siemens, Pratt & Whitney, and Rolls-Royce have already employed intelligent fiber optic sensors in the status monitoring of their engine/gas turbine products. However, China’s research in the field of fiber optic intelligent sensors started relatively late, especially in the area of intelligent fiber optic sensors for ultra-high temperature environments in combustion chambers, where the gap with foreign countries is particularly evident. This has led to China’s reliance on imported sensors in the R&D and production of high-end aircraft engines and gas turbines, which not only incurs high costs but also faces the risk of technological blockade.
Wide Temperature Range Silicon Pressure Sensor Chips: The “Guardians” in Extreme Environments
Wide temperature range silicon pressure sensors and chips occupy a crucial position in the sensor field, with a temperature range of -55°C to 225°C and an accuracy better than 25% FS. However, China’s research in this direction is still in the catch-up stage, with a significant gap compared to the world’s advanced level. High-reliability MEMS high-temperature silicon pressure sensors are a key area that needs breakthroughs, while the development of critical technologies such as low-stress leadless packaging, temperature compensation, and high-temperature dedicated circuit (ASIC) chips is also essential for achieving mass production and significant technological equipment applications. In extreme environments such as aerospace, petrochemicals, and automotive manufacturing, the performance of wide temperature range silicon pressure sensor chips directly relates to the reliability and safety of equipment, making technological breakthroughs crucial for the development of China’s high-end equipment manufacturing industry.
MEMS Gyro Chips: The “Cornerstone” of Consumer Electronics and Industrial Control
MEMS gyroscopes, as important basic components in the semiconductor industry, play a key role in various fields such as consumer electronics and industrial control. The technical threshold in the sensor field is relatively high, attracting significant R&D investment from numerous domestic and foreign manufacturers. However, the R&D of high-end products is still mainly concentrated in universities and research institutions. Enterprises and research units in Europe, America, and Japan have made significant progress in this field, but China started late in MEMS gyro chips and has a relatively slow development speed. Currently, there are very few domestic companies capable of independent design and mass production, with both output and market share at low levels. According to the “Blue Book on the Development of Sensors (Technology and Industry) in China,” many domestic consumer electronics manufacturers rely heavily on imported MEMS gyro chips, with an estimated import rate exceeding 80%. This severely restricts the development of China’s consumer electronics and industrial control fields, also putting China at risk of technological bottlenecks in these areas.
High-Performance Magnetic Sensors: The “Core Components” in Industrial and Automotive Fields
High-performance magnetic sensor technology has high barriers to entry and is widely applied in various fields, including industrial automation, medical devices, and the automotive industry, with enormous market potential. For traditional fuel vehicles, each car typically requires more than 30 magnetic sensors, involving aspects such as crankshafts, circuits, and pedals. In the field of intelligent autonomous vehicles, the demand for magnetic sensors will be even more urgent and detailed. However, the current magnetic sensor market in China is almost monopolized by foreign manufacturers, with a severe reliance on imports. International giants such as Honeywell, Murata, NXP, and Rohm dominate the market. Additionally, high-end magnetic sensors used in precision manufacturing, exploration, power, and instrumentation fields are mostly controlled by international sensor giants, posing a significant threat to China’s industrial upgrading and autonomy. The R&D foundation in the domestic magnetic sensor manufacturing field is relatively weak, with a lack of resources such as equipment and talent, leading to significant deficiencies in product performance, yield rates, costs, and production processes.
Infrared Array Sensors: The “Fire Eye” for Industrial Inspection and Security
Infrared array sensors are devices that integrate 80×60 to 240×180 sensitive units on a single chip, capable of receiving and detecting the infrared energy radiated by target objects. Through photoelectric conversion, they can output electrical signals related to the temperature distribution and infrared radiation intensity of the target object. Compared to widely used single-unit infrared sensors, infrared array sensors exhibit high precision, a wide detection range, and the ability to output visual image signals, showing broad application prospects in industrial inspection, home security, smart homes, energy-saving control, and medical care, and are expected to gradually replace single-unit infrared sensors as the market mainstream. According to statistics from the well-known market research firm Yole, the market size of infrared array sensors has exceeded $1 billion, with an annual growth rate exceeding 50%. However, the core technology of infrared array sensors is still monopolized by European and American manufacturers such as ULIS and FLIR, and domestic manufacturers still need to work hard to catch up in wafer-level packaging technology and dedicated signal processing chip technology.
Integrated Intelligent Sensors and Micro-System Modules: The “Smart Eyes” of the IoT Era
With the rapid development of the Internet of Things, mobile interconnectivity, and artificial intelligence technologies, the demand for intelligent sensors and micro-system modules is increasing. Global technology giants are scrambling to establish a presence in this field. Although China has clearly lagged behind in the field of individual sensors compared to Europe, America, and Japan, we are on the same starting line as the international advanced level in integrated intelligent sensors and micro-system modules. This undoubtedly provides a valuable opportunity for China to catch up and surpass. China should fully utilize advanced processes such as SESUB (Semiconductor Substrate Embedded) and SiP (System in Package) to promote the R&D and industrialization of integrated intelligent sensors and micro-system modules. At the same time, it is necessary to develop integrated intelligent sensors across environments, acoustics, and inertia, and expand their applications in consumer electronics, automotive electronics, and smart home fields such as mobile phones, watches, wristbands, wireless headphones, AR/VR, IoT, IPM (Intelligent Power Module), and TPMS (Tire Pressure Monitoring System).
China faces many technical challenges in the sensor field, but it also contains enormous development opportunities. By increasing R&D investment, strengthening industry-university-research cooperation, and cultivating high-end talent, China is expected to achieve breakthroughs in key technology areas such as intelligent fiber optic sensors, wide temperature range silicon pressure sensor chips, MEMS gyro chips, high-performance magnetic sensors, infrared array sensors, and integrated intelligent sensors and micro-system modules, realizing autonomous and high-quality development of the sensor industry, and providing strong support for the development of China’s high-end equipment manufacturing industry, the Internet of Things, and intelligent manufacturing.
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