According to a report by Taiwan’s “China Times News” on January 8, the technology of connecting several chips with different functions using advanced packaging technology to achieve the functionality of advanced process chips, known as small chips (or die), is seen as a shortcut for China to break through the US chip technology embargo. Jiangsu Changjiang Electronics Technology Co., Ltd. has begun mass production of chip packaging for international customers using its advanced packaging technology.
The mobile news app “Fast Technology” reported that in the face of semiconductor equipment embargoes imposed by Western countries on China, including extreme ultraviolet (EUV) lithography machines, the technology of combining mature process chips using small chips and other advanced packaging technologies to achieve the functionality of advanced process chips has become one of the important routes for China to break through the US technology blockade, with significant progress expected soon.
The report stated that Jiangsu Changjiang Electronics Technology Co., Ltd. announced that its XDFOI small chip high-density multidimensional heterogeneous integration series process has entered a stable mass production phase as planned, simultaneously achieving the shipment of multi-chip system integration packaging products for international customers at the 4nm node, with the maximum packaging area of approximately 1500 square millimeters for system-level packaging.
It is understood that Jiangsu Changjiang Electronics Technology Co., Ltd. will fully leverage the technical advantages of this process in high-performance computing, artificial intelligence, 5G, automotive electronics, and other fields, providing downstream customers with manufacturing solutions for chip products that are lighter, faster in data transmission rates, and lower in power consumption.
Initially, international semiconductor companies developed small chip technology not because of the US technology embargo, but as advanced processes continued to deepen, with process technology gradually approaching physical limits, the competition in semiconductor equipment technology became fierce, and the prices and manufacturing costs of equipment such as lithography machines skyrocketed, forcing the industry to seek new alternative technologies, with small chips being one of them.
The concept of small chips is not to insist on integrating all transistors into a single chip, but to integrate multiple functionally different chips together through advanced packaging technology to form a system-on-chip, thus achieving similar performance requirements without using advanced process chips.
Currently, semiconductor companies such as TSMC and Qualcomm, as well as IT giants like Google and Microsoft, are collaborating on small chip technology, publicly releasing a universal small chip interconnect standard and forming an industry alliance. China, facing embargoes on advanced process equipment, aims to use this to break through the US chip technology blockade, potentially allowing for a leapfrog development in the semiconductor industry.
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Supervised by | Cheng Rui
Reviewed by | Tian Xin
Edited by | Xu Haiting
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