AMD’s New 2nm EPYC Processor Completes Tape-Out; TSMC Plans to Mass Produce Advanced Panel-Level Packaging by 2027; Five US Companies Sue Trump Administration
1. AMD’s new EPYC processor completes tape-out using TSMC’s 2nm process 2. TSMC plans to mass produce advanced panel-level packaging by 2027 3. Apple to analyze user data from devices to enhance AI technology 4. Reports indicate Taiwanese bidders are competing for AMD’s ZT server assets 5. Five US companies jointly sue the Trump administration … Read more