1. Definition and Core Modules of SoC Chips Definition: SoC (System on Chip) integrates key components such as CPU, GPU, NPU, memory, and baseband into a single chip, achieving complete system functionality. It is the core of smart devices such as smartphones, smart home appliances, and automotive electronics. Core Modules: Includes CPU (computational control), GPU … Read more
Overview of the G2D Module Author: @chhjnavy Original Article: https://bbs.aw-ol.com/topic/3291/ Main Functions of G2D: 1) Rotation: Supports 90, 180, 270 degrees; 2) Scale: Scaling; 3) Mirroring: Horizontal / Vertical; 4) Transparent Overlay: Achieves overlay of two RGB images; 5) Format Conversion: Various format conversions such as YUV to RGB; 6) Rectangle Filling, and many other … Read more
Hardware Module Support The T527 integrates multiple hardware modules related to graphics display and codec, providing a robust hardware foundation for high-definition image display, high-definition video playback, and multiple high-definition camera inputs: ARM Mail-G57 GPU Self-developed Display Engine De-interlacing Unit 2D Graphics Acceleration Unit Video Codec Engine Self-developed Image Signal Processor (ISP) Visual Image Processing … Read more
Click the blue text above to follow our branch Latest news, Rockchip’s AI audio processing chip RK2118G-YX has successfully passed two core certifications from DTS: DTS Virtual:X (for AVR/Soundbar products) and DTS:X certification. The official statement indicates that this marks a breakthrough for Rockchip in the high-end audio processing technology field, providing immersive sound solutions … Read more
Although both packaging substrates (IC packaging boards) and printed circuit boards (PCBs) serve connection and support functions in electronic devices, there are essential differences between the two in terms of definition, functional positioning, technical parameters, material processes, and application scenarios. 1. Core Definitions and Functional Positioning Differences 1.Packaging Substrate lDefinition: A special substrate that directly … Read more
Definition of Impedance In a circuit with resistance, inductance, and capacitance, the hindrance to the current in the circuit is called impedance. Impedance is commonly represented by Z, which is a complex number. The real part is called resistance, and the imaginary part is called reactance. The hindrance caused by capacitance in the circuit to … Read more
The essence of the industry is to burn money for technology; without money, you are out. Equipment is as expensive as a money printing machine, with an investment of over 1 billion for a high-end HDI production line, and even more for lines with more than 18 layers. Huadong Technology’s factory in Thailand invested 1.7 … Read more
Summary of developments related to NVIDIA server PCB products:1. H100 Related Information• Order Visibility: Currently, order visibility extends to August, and subsequent production schedules are closely dependent on client demand trends. If client demand remains stable, production schedules after August may maintain the current pace; however, any fluctuations in client demand, whether an increase leading … Read more
When designing PCBs, the design requirements for common hardware interfaces are crucial for ensuring circuit performance and stability. Below are some common hardware interface PCB design requirements: 1. USB Interface Design Requirements ① Total length control: Keep it within 1800 mils as much as possible. ② Differential pair characteristic impedance: 90Ω. ③ Power pin trace … Read more
1: Drawing Arduino Circuit Boards (Schematic Library, PCB Library, Schematic, PCB Drawing) 1. Drawing Schematic Library (Use existing libraries, or create your own) [SCH Library] Here is an example Add sub-file: Select -> Tools -> New Component Method 1: Draw one by one Below are some examples and effect images ATMEGA328P-AU CH340G LM358 USB-B PT … Read more