Apple recently quietly released the 2016 new Retina MacBook laptop, still featuring a 12-inch 2304×1440 screen, but the processor has been upgraded to the sixth generation Core Skylake-Y Core m series, with an integrated HD 515 graphics card, 8GB LPDDR3 memory upgraded to 1866MHz, and the battery capacity increased to 41.4Wh, allowing up to 10 hours of use, and adding a rose gold color option.
The m3/256GB and m5/512GB models are available in four color versions, priced at 9288 yuan and 11288 yuan respectively, while the m7 model needs to be customized.
iFixit has completed the disassembly of the new laptop, and it is the rose gold version, which looks really great!
Does it look good?
The appearance is exactly the same as last year’s model
The model is still A1534, with the EMC number changing from 2746 to 2991
Opening the case reveals the general internal structure
Touchpad chip details:
– Red: Broadcom BCM5976 touch controller
– Orange: STMicroelectronics 32F103 ARM Cortex-M3 microcontroller
– Yellow: International Rectifier IRFH3702 single N-channel HEXFET Power MOSFET
Note the screws in the red box, they are cross-shaped
This is last year’s model, which has triangular screws
The screws at the hinge have a fragile substance on top, which must be destroyed to remove them—preventing users from disassembling it themselves?
The USB Type-C data line has also changed, fixed to the USB board
The USB main controller is Parade Technologies PS8741A, last year’s was PS8740
The battery appearance has hardly changed
However, the capacity has increased by 4%, from 7.55V, 39.71Wh to 7.56V, 41.41Wh, allowing for up to 11 hours of movie watching
Mainboard front chip details:
– Red: Intel SR2EN Intel Core m3-6Y30 dual-core processor
– Orange: Toshiba TH58TFT0DFKLAVF 128GB MLC NAND flash (another chip is on the other side)
– Yellow: Micron MT41K256M16LY-107 512MB DDR3L SDRAM cache
– Green: Universal Scientific Industrial 339S0250 Wi-Fi module
– Cyan: Broadcom BCM15700A2
– Blue: National Semiconductor 48B1-11
– Purple: F4432ACPE-GD-F
Mainboard back chip details:
– Red: Toshiba TH58TFT0DFKLAVF 128GB MLC NAND flash
– Orange: Samsung K3QF4F4 4GB LPDDR3-1866 memory (two chips totaling 8GB)
– Yellow: Apple 338S00066 SSD controller (last year’s was 338S00055)
– Green: Texas Instruments/Stellaris LM4FS1EH SMC controller
– Cyan: SMSC 1704-2 temperature sensor
– Blue: Texas Instruments SN650839
– Purple: Texas Instruments TPS51980A
There are also two more:
– Red: Texas Instruments CD3215B01 61AHXHW
– Orange: Intersil 95828
That’s it for the disassembly……
1 point, almost impossible for individuals to disassemble