On March 25, 2025, global semiconductor solution provider Renesas Electronics (TSE: 6723) announced the launch of the industry’s outstanding new Bluetooth chip – DA14533. This chip integrates a radio frequency transceiver, Arm® M0+ microcontroller, memory, peripherals, and security features into a compact system-on-chip (SoC) design. As the first device in Renesas’ low-power Bluetooth® SoC product family to receive automotive certification, the DA14533 features advanced power management capabilities that simplify system integration and reduce power consumption. With a certified Bluetooth Core Specification 5.3 software stack and extended temperature support, developers can quickly initiate diverse application development projects, including tire pressure monitoring, keyless entry, wireless sensors, and battery management systems.
Optimized Design for Exceptional Energy Efficiency
Based on Renesas’ cutting-edge position in low-power Bluetooth SoCs (SmartBond Tiny product family) and the industry’s superior low-power technology, the new DA14533 integrates the most advanced power management features: the product includes an integrated DC-DC buck converter that can precisely adjust the output voltage according to system requirements; under operational conditions, its system power consumption is significantly lower than that of competing products, requiring only 3.1mA during transmission and dropping to 2.5mA during reception; in sleep mode, the current is as low as 500nA. These power management and energy-saving features help significantly extend the lifespan of small battery-powered systems and easily meet the stringent power consumption requirements in tire pressure monitoring system task configurations.
AEC-Q100 Automotive Grade Certification with Latest Security Features
The DA14533, as a product compliant with AEC-Q100 Grade 2 standards, means it has passed rigorous testing to ensure exceptional quality and reliability in extreme automotive environments. Additionally, the product’s extended temperature range (-40 to +105°C) further guarantees reliable performance under harsh conditions, making it an ideal choice for automotive, industrial, and other fields with high demands for stability and durability. The product complies with Bluetooth Core Specification 5.3 and includes the latest security features to protect connected devices from various threats.
Chandana Pairla, VP of Connectivity Solutions Division at Renesas, stated: “Our SmartBond Tiny SoC product family has achieved significant success in the industrial market, with over 100 million units shipped to date. This new automotive-grade product will help the next generation of battery-powered automotive and industrial systems explore new horizons in low-power Bluetooth applications, fully meeting the stringent requirements for high energy efficiency, compact size, and broader temperature adaptability in these applications.”
Reducing BOM, Lowering Costs, and Simplifying Development
Similar to other low-power Bluetooth SoCs in the SmartBond Tiny product family, the DA14533 requires only six external components, providing a best-in-class engineering bill of materials (eBOM).
A single external crystal (XTAL) is used for both operational and sleep modes, eliminating the need for a separate oscillator for sleep mode. The ultra-compact design in a WFFCQFN 22-pin 3.5mm x 3.5mm package makes it the smallest automotive-grade low-power Bluetooth SoC on the market. Thanks to its compact design and simplified eBOM, this product can be seamlessly integrated into space-constrained systems, thereby reducing overall system costs and shortening time-to-market for customers.
Key Features of DA14533
Arm® Cortex®-M0+ microcontroller: serves as an independent application processor or data pump in a host system
64KB RAM and 12KB one-time programmable (OTP) memory
2.4GHz radio frequency transceiver
Integrated IQ buck DC-DC converter
External SPI flash memory
Single XTAL operation (single crystal oscillator)
Certified Bluetooth Core Specification 5.3 software stack
AEC-Q100 Grade 2 certified, supporting a wide operating temperature range (-40 to +105°C)
WFFCQFN 22-pin 3.5mm x 3.5mm package
Successful Product Combinations
Renesas combines this new low-power Bluetooth SoC with R-Car H3/M3/E3 SoCs, PMICs, and timing devices to provide various “successful product combination” solutions, including tire pressure monitoring systems. Renesas’ “successful product combinations” rely on mutually compatible and seamlessly collaborating devices, utilizing a proven system architecture that delivers optimized low-risk designs and accelerates time-to-market. Based on the various products in its portfolio, Renesas has launched over 400 “successful product combinations” aimed at helping users drive the design process and speed up time-to-market. For more information, please visit: renesas.com/win.
Supply Information
The DA14533 is now available, accompanied by a professional version of the low-power Bluetooth SoC development kit. This kit includes a mainboard, sub-board, and cables to facilitate application software development; the sub-board can also be purchased separately to simplify development. A blog about this new product is also available for reference.