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Integrated Circuit (integrated circuit) is a type of micro electronic device or component. It uses a certain process to interconnect the necessary components such as transistors, resistors, capacitors, and inductors in a circuit, fabricating them on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaging them into a shell, forming a miniature structure with the desired circuit functionality; all components are structurally combined into a whole, making a significant step towards miniaturization, low power consumption, intelligence, and high reliability of electronic components, denoted by the letters “IC” in the circuit.
IC engineers will encounter some professional IC vocabulary in their daily study and work. In this issue, we mainly sort common IC vocabulary from H to N by the first letter, see which Chinese and English abbreviations are available, and students in need are welcome to like, bookmark, or share it. Of course, if there are any errors or omissions, everyone is welcome to correct them in the comments section~
Hall: Hall Sensor
HDMI: High Definition Multimedia Interface, a digital video/audio interface technology specification
HDL:Hardware Description Language
HVL:Hardware Verification Language
hardware: Hardware
hole : Hole
Hybrid circuit : Hybrid Circuit
IC:Integrated Circuit
l code:Instruction Code
IP:Intellectual Property, refers to the patent for a certain design technology in chip design
IP Core: Refers to reusable design modules with independent intellectual property functions in integrated circuit design.
IGBT:Insulated Gate Bipolar Transistor
I/O: Input and output of data between internal memory and external memory or other peripheral devices
I/F interface: GPIO (General Purpose Interface), SPI Serial Peripheral Interface, I2C, UARI
IT:Information Technology
image: Image
implantor: Ion Implantation Machine
integration: Degree of Integration
Internet :International Network
Intrinsic Semiconductor:Intrinsic Semiconductor
ion implantation, implant : Ion Implantation
IRC:Integrated Remote Control Console
Integrated Circuit (IC): A type of micro electronic device or component, using integrated circuit processing technology to connect the required transistors, resistors, capacitors, and inductors according to requirements, fabricated on the same wafer substrate to achieve a circuit with specific functions.
Integrated Circuit Wafer Foundry: Uses 8-inch or 12-inch wafers as raw materials, utilizing a photomask with circuit information, through processes such as photolithography and etching, to integrate the customer’s required circuit layout onto the wafer.
Wafer: A silicon semiconductor integrated circuit wafer that has been processed to have specific circuit functions, which can be made into IC products after cutting, packaging, and other processes.
LCM LCD: Display Driver Interface
Layout: Layout, refers to the final layout generated for the chip, similar to design blueprints in the construction industry
LPS:Low Power Simulation, commonly used in low power design verification
LVDS:Low Voltage Differential Signaling, a low-swing differential signaling technology that allows signals to be transmitted at rates of hundreds of Mbps over differential PCB pairs or balanced cables, achieving low noise and low power consumption with low voltage swing and low current drive output
LVS:Layout versus Schematic, a check after IC Design Layout to see if the layout is consistent with the gate-level circuit
LUT:Look-Up-Table, essentially a RAM
LSI:Large Scale Integration, logic gates 101 (1k or 1,001 transistors) 10k
LDO:Linear Voltage Regulator
LDW:Lane-Departure Warning
LPCVD:Low Pressure Chemical Vapor Deposition
Moore’s Law:Gordon Moore proposed Moore’s Law: its core content is that the number of transistors that can be accommodated on an integrated circuit doubles approximately every 18 to 24 months. In other words, the performance of processors doubles approximately every two years, while the price drops to half of what it was before.
MCU:Micro Controller Unit, the main control module
MIPI:Mobile Industry Processor Interface, an open standard and specification for mobile application processors
MIPS:A type of RISC instruction architecture
MCDF:Multi-Channel Data Shaper
MEMS:Micro-Electro-Mechanical System, sensors
MOP:Moving Object Detection
MSB:Most Significant Bit, the highest significant bit of multi-bit data, corresponding to the concept of LSB
MSI:Medium Scale Integration
MOS:Metal-Oxide-Semiconductor
MOSFET:Metal-Oxide-Semiconductor Field Effect Transistor
mask : Mask (plate), photomask, base plate
megasonic (ultrasonic) : Ultrasonic
NDR:Non-Default Route, an important concept in layout implementation
Netlist:Gate-Level Netlist, generally a netlist file generated by RTL Code after synthesis tools
NRE:Non-Recurrent Engineering, abbreviation for non-repeating engineering costs
NFC:Near Field Communication, a type of short-range wireless communication technology
NoC:Network on Chip, an electronic system based on network communication implemented on a single chip
NOR Flash :Fast reading speed, slow writing
Nand Flash: Slow reading speed, fast writing
nanometer(nm) : Nanometer
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