This May, MediaTek launched the new Dimensity series, introducing the flagship Dimensity 9200+ chip. The Dimensity 9200+ chip is based on TSMC’s second-generation 4nm process and features an octa-core CPU, including one Arm Cortex-X3 super core with a clock speed of up to 3.35GHz, three Arm Cortex-A715 large cores at 3.0GHz, and four Arm Cortex-A510 efficiency cores at 2.0GHz. Additionally, the Dimensity 9200+ is equipped with an 11-core Immortalis-G715 GPU.
With the official release of the Dimensity 9200+, news about the next-generation flagship chip has started to emerge. Reports indicate that the next flagship chip is expected to be called the Dimensity 9300. According to previous teasers from the official source, “MediaTek’s next-generation Dimensity flagship chip will adopt Arm’s latest Cortex-X4 and Cortex-A720 CPU IP, as well as the Arm Immortalis-G720 GPU, which will provide stunning performance and efficiency for mobile devices through groundbreaking architectural design and technological innovation, opening up a new mobile experience!”
According to the official teaser, the Dimensity 9300 chip will utilize Arm’s latest CPU IP, including the new Cortex-X4 super core and Cortex-A720 performance core. In terms of GPU, the Dimensity 9300 will feature the newly launched Arm Immortalis-G720 GPU. Additionally, information released by Arm indicates that the performance of the Cortex-X4 has improved by over 15%, with power consumption reduced by 40%, while the efficiency of the Cortex-A720 has also increased by 20%. Today, digital blogger @数码闲聊站 revealed more information about the Dimensity 9300 chip.
The blogger stated that the Dimensity 9300 is tentatively scheduled to launch in October, built on TSMC’s N4P process, featuring a new architecture of 4 Cortex-X4 super cores and 4 Cortex-A720 large cores, along with the Immortalis-G720 GPU. Furthermore, the Dimensity 9300 will be the first to support 9.6Gbps LPDDR5T memory, which is reportedly 13% faster than the previous generation LPDDR5X. According to a previous leak from the blogger, the CPU frequency for the Dimensity 9300 is tentatively set at a minimum of 3.0GHz for the X4 super core and 2.0GHz for the A720 large core, with final adjustments based on the Snapdragon 8 Gen 3 frequency.
The blogger also previously revealed that the Dimensity 9300 might be released before the Snapdragon 8 Gen 3, with the vivo X100 series expected to be the first to feature this chip.
It is reported that Qualcomm has officially announced that the 2023 Snapdragon Technology Summit will be held from October 24 to October 26, where the new Snapdragon 8 Gen 3 is expected to be unveiled. This means that the Dimensity 9300 may officially debut before October 24 this year.
Currently, there are also numerous leaks regarding the Snapdragon 8 Gen 3 chip. A leak from the same digital blogger @数码闲聊站 mentions that the single-core score of the Samsung S24+ equipped with the Snapdragon 8 Gen 3 is 2233, while the multi-core score is 6661.
In comparison, the Samsung Galaxy S23 Plus equipped with the 3.36GHz Snapdragon 8 Gen 2 has a single-core score of 2005 and a multi-core score of 5274; devices with the Dimensity 9200+ have a single-core score of 2117 and a multi-core score of 5583. In terms of specifications, the Snapdragon 8 Gen 3 will be built on TSMC’s N4P process, featuring 1 Cortex X4 super core at 3.3GHz, 3 Cortex-A720 large cores at 3.15GHz, 2 Cortex-A720 large cores at 2.96GHz, and 2 Cortex-A520 small cores at 2.27GHz, along with an Adreno 750 GPU.
As for the mobile products that may feature this chip, several have already been exposed. Based on previous information, it seems more likely that Xiaomi’s new generation flagship will be the first to feature it. Meanwhile, brands such as Motorola, OPPO, vivo, iQOO, OnePlus, and Realme are also expected to launch mobile products equipped with the Snapdragon 8 Gen 3 chip. Overall, this year, MediaTek’s Dimensity flagship chip and Qualcomm’s Snapdragon flagship chip are expected to be released around the same time, both bringing further performance upgrades. The actual performance of mobile products equipped with these respective chips is also highly anticipated.
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