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On April 12, 2025, GAC Group officially released 12 vehicle-grade chips at its Technology Day event. These chips were jointly developed by GAC Group in collaboration with ZTE Microelectronics, Yutai Microelectronics, Renxin Technology, Silergy Corp, Jihai, Yisiwei, Jiewate, Guoxin, and Meitai.
Among them, the C01 chip, developed in collaboration with ZTE Microelectronics, is China’s first independently designed next-generation 16-core multi-domain integrated central processing chip; the G-T01 chip, co-developed with Yutai Microelectronics, is the first vehicle-grade gigabit Ethernet TSN switch chip with the highest capacity in the country; the G-T02 chip, developed with Renxin Technology, is the world’s first SerDes chip with a bandwidth of up to 16Gbps; and the G-K01 chip, developed with Silergy Corp, is the world’s first 6-core RISC-V chip that meets ASIL-D functional safety standards.
The other chip partners are as follows:
G-S01 partner: Jihai, G-T03 partner: Jihai, G-H02 partner: Guoxin, G-P01 partner: Silergy Corp, G-S02 partner: Meitai Technology, G-T04 partner: Guoxin, G-H01 partner: Jiewate, G-K02 partner: Yisiwei.
The application scenarios for these chips cover multiple fields such as smart vehicle power management, braking, and integrated safety. In terms of power management, these chips can effectively improve energy utilization and significantly extend the range of electric vehicles. In braking, the G-T01 chip responds faster when processing high-speed data, significantly reducing braking response time, adding an extra layer of safety for driving. In integrated safety, the innovative design of the C01 chip enhances the overall integrated safety performance of the vehicle, allowing it to better respond to emergencies in extreme situations.
The release of these 12 vehicle-grade chips by GAC Group not only marks a technological breakthrough in the field of smart vehicles but also promotes technological self-innovation in the Chinese automotive industry. Additionally, GAC Group announced the “Automotive Chip Application Ecosystem Co-construction Plan,” aiming to deepen collaborative innovation in “industry-university-research-application” to create an end-to-end verification platform for vehicle-controller-chip interactions and implement a “one chip, multiple sources” strategy to ensure the security and stability of the supply chain.
Source: Daily IC
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