Core Enterprises in 13 Major Sub-industries of the IC Industry Chain

Semiconductor Equipment Companies: North Huachuang Microelectronics Equipment, Zhongwei Semiconductor Equipment, Shanghai Microelectronics Equipment, Tuojing Technology, China Electronics Technology Group, Zhongwei Semiconductor, Qixing Huachuang, Huahai Qingke, Shennan Circuit, Ruili Scientific Instruments, Shanghai Microelectronics, Dayi Heng Precision Machinery, Hanmin Technology, Qisheng Machinery Equipment, Shanghai Kangsis Trading, etc.

Semiconductor Manufacturing Companies: SMIC, Samsung (China) Semiconductor Co., Ltd., SK Hynix Semiconductor (China) Co., Ltd., China Resources Microelectronics, Huahong Grace, Intel Semiconductor (Dalian) Co., Ltd., TSMC (Taiwan), Huali Microelectronics, Xi’an Microelectronics, Hejian Technology, UMC (Taiwan), Lijing (Taiwan), Wuhan Xinxin, Junyao Electronics, Jilin Huamei Electronics, Shanghai Beiling, Suzhou Goodix, Yangjie Technology, Silan Micro, Dongchen Electronics, Advanced Semiconductor, Wuxi Narui Electronics, Chipone Technology, Xi’an Aerospace Huaxun, Gaoyun Semiconductor, Founder Microelectronics, etc.

Semiconductor Packaging and Testing Companies (including foreign-funded and Taiwanese companies in China): Tongfu Microelectronics, Tianshui Huatian, Nantong Huada Microelectronics, Weixun United Semiconductor, Intel Products (Chengdu) Co., Ltd., Haita Semiconductor (Wuxi) Co., Ltd., Jiangsu Xinchao Technology, Anke Packaging Testing (Shanghai) Co., Ltd., Shengdie Semiconductor (Shanghai) Co., Ltd., ASE, SPIL, Licheng, Nanmao, etc.

In recent years, mainland LED manufacturers have rapidly risen, propelling China to become the world’s largest LED chip manufacturing country. Currently, the global LED chip market is mainly divided into three camps. Japanese and European and American manufacturers form the first camp, South Korea and Taiwan form the second camp, and mainland manufacturers form the third camp.

Foreign LED Chip Manufacturers: Nichia Chemical (Japan), Toyota Tsusho (Japan), Cree (USA), Osram (Germany), Agilent (USA), Toshiba (Japan), Lumens (headquartered in the USA, acquired by Philips), Seoul Semiconductor (South Korea), Showa Denko (Japan), Axiom (USA), etc.

The drone industry chain mainly includes two categories: one is complete machine manufacturers like DJI and GoPro; the other is upstream manufacturers that provide hardware and software for drones, including chips, flight control, batteries, sensors, GPS, gyroscopes, power systems, data systems, etc. In terms of hardware, chips are the core components, directly determining the drone’s control performance, communication capabilities, and image processing capabilities.

Drone Main Control Chip Manufacturers: Qualcomm, Intel, STMicroelectronics, Texas Instruments, Samsung, Atmel, NVIDIA, Nuvoton, Allwinner Technology, Leadcore, HiSilicon, etc.

Since Amazon launched the Echo smart speaker in 2014, more and more Internet giants have begun to join this increasingly hot market. Following Alibaba’s “Tmall Genie,” Tencent recently announced that its smart speaker product “Ear” will be launched around August. Additionally, JD.com’s “Dingdong” and Baidu’s DuerOS smart chip have also made moves in the smart speaker field, and the product roadmap for major Internet companies in this area is becoming clearer.

The enthusiasm in the mid- and downstream industries is also driving upstream chip manufacturers to stock up actively. Qualcomm, MediaTek, Intel, and Unisoc have all launched smart speaker product lines this year.

Listed Companies: GoerTek, Aerospace Electronics, Huada Technology, Dongfeng Technology, Aerospace Mechatronics, Tongding Interconnection, Huagong Technology, Kelun Electronics, Silan Micro, Robot, Unigroup Guoxin, Suzhou Goodix, Hanwei Electronics, AVIC Electric Measurement, Sanofi Biological, Xinlian Electronics, Shanghai Beiling, Jingfang Technology, Weier Technology, etc.

Foreign-funded Enterprises in China: Siemens Sensors and Communications (SSCL), SICK Sensors (Guangxi), Turck (Tianjin) Sensors, Mechatronics (Xiamen), MTS Sensors China, Balluff Sensors (Chengdu), Weigela Sensors (Shanghai), Delta Sensors (Changzhou), Mody Sensors (Tianjin), etc.

Cathode Material Manufacturers: Nichia Chemical, Hitachi Chemical, Qingmei Chemical, Tanaka Chemical, Mitsubishi Chemical, L&F, UMICORE, Ecopro, A123, Valance, Saft, Hunan Sanyang, Peking University First, Dingsheng Technology, Bamo Technology, Hunan Ruixiang, Ningbo Jinhao, Tianjiao Technology, Xiamen Tungsten Industry, Zhenhua New Materials, Qianyun High-tech, etc.

Anode Material Manufacturers: Japan Chemical, Japan Carbon, JFE Chemical, Mitsubishi Chemical, BTR, Shanghai Sanyang, Jiangxi Zhi Chen, Shenzhen Snow, Xingyuan Graphite, Jiangxi Zhengtuo, Huzhou Chuangya, Tianjin Jinmei, Chengdu Xingneng, etc.

Separator Manufacturers: Asahi Kasei, Celgard, Exxon-Tonen, Ube Industries, Sumitomo Chemical, SK, Xingyuan Materials, Zhongke Technology, Jinhui High-tech, Cangzhou Mingzhu, Henan Yiteng, Nantong Tianfeng, Donghang Optoelectronics, Hebei Jinli, Tianjin Donggao, Shandong Zhenghua, etc.

Electrolyte Manufacturers: Xinzhou Bang, Duofuduo, Mitsubishi Chemical, Fujifilm Industrial, Mitsui Chemicals, Morita Chemical, Kanto Denka, SUTERAKEMIFA, Samsung (Korea), Jiangsu Guotai, Tianjin Jinniu, Dongguan Sanyang, Guangzhou Tianci, Dongguan Kaixin, Zhuhai Saiwei Electronics, Beijing Chemical Reagent Research Institute, Shantou Jinguang, Chaozhou Chuangya, etc.

Currently, the global semiconductor discrete device market is mainly dominated by countries such as the USA, Europe, and Japan, especially in the high-end market where they hold absolute power. Due to the lack of scale and cluster effects among domestic manufacturers, their production still mainly relies on the “OEM” model.

USA: The USA currently leads the global semiconductor discrete device market, with a large number of globally influential discrete device manufacturers such as TI, IR (International Rectifier), Diodes, Fairchild (acquired by ON), ON Semiconductor, Vishay, etc. In addition, American semiconductor manufacturers also have an absolute advantage in the power management chip field, mainly targeting the Asia-Pacific market.

Europe: Major companies include Infineon, NXP (acquired by Qualcomm), STMicroelectronics, etc., which are globally recognized semiconductor manufacturers with complete product lines, possessing leading capabilities in both ICs and discrete devices. In terms of market customer distribution, the Asia-Pacific region is also the largest application market for European manufacturers, followed by the European market.

Mainland China: In recent years, China’s global influence in semiconductor discrete devices has been steadily increasing, and it is now the largest market for discrete devices worldwide. Hong Kong, Taiwan, and South Korea are the main export markets for domestic semiconductor discrete devices, with Hong Kong being the largest export market. Currently, Guangdong, Jiangsu, and Shanghai are the top three provinces in terms of domestic semiconductor discrete device exports, with coastal provinces remaining the main exporters.

Domestic discrete device manufacturers include Yangjie Technology, Huamei Electronics, Suzhou Goodix, Taiji Technology, Kaihong Technology, Hualian Electronics, Leshan Radio, Huashan Electronics, Qinyi Electronics, Xier Electronics, Weiguang Technology, Liao Crystal Electronics, Mingxin Microelectronics, Yandong Microelectronics, Galaxy Century Microelectronics, Shenai Semiconductor, Aier Semiconductor, Yaguang Electronics, China Resources Microelectronics, Zhonghuan Semiconductor, Dongchen Electronics, etc.

Chip Manufacturers: Geke Micro, OV, Sibico, Sony, Samsung, Hynix, Aptina, etc.

Lens Manufacturers: Xuye Optoelectronics, Chuanhetian Optoelectronics, Shenzhen Dali, Lini Optoelectronics, Sunny Optical, Dule Optoelectronics, Xinxu, Jinglongda, Huaxin Optoelectronics, Xingbang Optoelectronics, etc.

Module Manufacturers: Sunny Optical, OFILM, Xinyi, Qiutai Micro, Shengtai, Chengxiangtong, Meixinai, Guangzhen, Jinkang, Kaimujin, Fangdeya, Riyong, Sanglaisi, Sanwinxing, Donghengsheng, Tongju, Bolixin, Daling, Ketong, Zhuoruixin, Sijichun, Guangbao, Qunguang, Foxconn, Yiweili, Dongju, Zhongguangdian, Zhengqiao Imaging, Baichen, Kaier, Minxiang, Kanglong, etc.

IGBT is an important component of semiconductor discrete devices, and currently, 70% of the global IGBT module market is controlled by Japanese companies, with Germany’s Infineon holding the highest market share of 24.7% in the independent IGBT power transistor field. The best-performing domestic IGBT manufacturers include CRRC Times, Jiaxing Star, and BYD.

Foreign: Hitachi, Infineon, Mitsubishi, Fuji Electric, Toshiba, ABB, ON Semiconductor, ADI, Vishay, Semikron, Weico, Danfoss, etc.

Domestic: IDM manufacturers include CRRC Times, Jiaxing Star, BYD, Silan Micro, Huamei, AVIC Microelectronics, Zhonghuan Co., etc.; module/design manufacturers include Yongdian, Aipak, Xinjia, Hongwei, Nanjing Yinmao, etc.; design manufacturers include ZK Junxin, Xinpai, Huamei Spark, Das, Tongfang Micro, New Energy, Jinxin Microelectronics, Keda, etc.; in manufacturing, major manufacturers include Huahong Grace, Advanced Semiconductor, SMIC, Founder Microelectronics, China Resources Shanghua, etc.

Currently, the global MLCC (multi-layer ceramic capacitor) market is mainly dominated by Japanese and Korean manufacturers, with Japan’s Murata being the largest MLCC supplier in the world. South Korea’s Samsung Electro-Mechanics ranks second in the global MLCC market share.

Foreign: Japanese manufacturers include Murata, Taiyo Yuden, Kyocera, TDK, etc., while Korean manufacturers include Samsung Electro-Mechanics and Sanwa Capacitors.

Domestic: Taiwanese manufacturers include Yageo, Walsin Technology, and He Shentang, while mainland manufacturers include Fenghua Advanced Technology, Yuyang Technology, and Torch Electronics.

Chip Manufacturers: Silan, Novatek, OmniVision, Geke Micro, Aoyuan, Tianli, Tianyu, Ruida, Renesas, New Thinking Micro, Yili, etc.

Module Manufacturers: Tianma, Tongxingda, Xinyi, Sanlong Display, TCL Display, Dijing, Zhongguangdian, Tianyifu, BYD, Yongxin, Xingyuan, Yucai, Guoxian, BOE, Baoruisi, Yidu, Sharp, Toshiba, NEC, Hitachi, Kyocera, Mitsubishi, Sony, Fujitsu, Yihua, Boyi, Yuxinda, Younasi, Weituo, BYD, Yushun, Haifei, Desipu, Kaishengde, Lide Communications, Laibao, Xingshan, Juri Ding, Yikuaile, etc.

In terms of panel manufacturing: Korea has LG, Samsung, HYDIS, Hyundai, and Jin Xing; Europe and America have E Ink, IBM, Pixel Qi, Epson, FINLUX, etc.; Japan has Sharp (acquired by Foxconn), Toshiba, Panasonic, NEC, Kyocera, Mitsubishi, Kowa, Sanyo, Sony, IDTech, Fujitsu, Seiko, IPS Alpha, Casio, STI, Pioneer, Xingdian, IMLS, Citizen, and Alps.

In recent years, mainland panel manufacturers have rapidly risen, with BOE leading the way and successfully entering the Apple supply chain. In addition to BOE, major domestic manufacturers include Tianma, Qixin, Longteng, Shangguangdian, Qiling, Lingju, Qingda Optoelectronics, Xinyi, Zhongxing Optoelectronics, China Electronics Panda, BYD, Huasan, Hisense, Visionox, Hantu Micro, Changzhi Optoelectronics, Rainbow, Baoruisi, Debang, Hongou, Jilin Caijing, Yidu, Pingda, Static Electricity, and Zhixuan.

Touch Chip Manufacturers: Atmel, BYD Microelectronics, Cypress, Duntai, Mstar, Goodix Technology, Synaptics, Silergy, Juyou, Xunjun, Jichuang North, Silan, Better Life, Novatek, OmniVision, Yili, etc.

Touch Screen Manufacturers: 3M, LG Innotek, Fujitsu, Nissha, Sharp, OFILM, Xinyi, Bourns, Chimei, TPK, Shenyue Optoelectronics, Helitai, Yejiji, Chaosheng, Laibao, Yanghua, Lianchuang, Shengdai, Junda, Dijing, Depu, Junye, Rongna, Yushun, Huarui Chuan, Xudong, Ouleiden, Hangtai, Wanjing, Zhiheng Zhuoyue, Pingbo, Xingshan, Zhonghai, Deren, Dixiang, Akita Micro, De Yi, Puda, Dunjeng, Weiguangjun, Yucheng, Caitongda, Baoming, Shengnuo, BOE, Zhengxing, Hongzhan Light, Nanfeng, Puxing, Shitong, Yuyue, Beitai Display, etc.

Foreign Connector Giants: TE Connectivity, Molex, Amphenol, FCI, Shentai, Jae, 3M, Yazaki, JST, Phoenix, Delphi, KET, Panasonic, Hirose Electric, Sumitomo Electric, Weidmüller, HARTING, Ranhu Electronics, Oudu, etc.

Chinese Connector Giants: Luxshare Precision, AVIC Optoelectronics, Changying Precision, Derun Electronics, Rihai Communications, Aerospace Electronics, Wutong Holdings, Yonggui Electric, Ruibao Co., Sichuan Huafeng, Aerospace Electronics, Foxconn, Shiying Co., Lianzhan Technology, Hechang, Zhengwei, etc.

Source: Investment Promotion General Reference