Using serial ports to print debugging information is a common debugging method, known for its simplicity and ease of use, but it also has significant limitations:– It does not support advanced features such as breakpoints, single-step tracing, and memory read/write.– Excessive printed debugging information can impact performance, while too little information may be insufficient to … Read more
The Internet of Things (IoT) continues to transform various industries, making design decisions around wireless connectivity components increasingly complex. Engineers often face a dilemma when selecting components for their IoT applications, having to choose between IC and wireless modules. Both options have unique advantages and trade-offs that impact design complexity, cost, scalability, and time to … Read more
1. Revenue Rockchip: 3.14 billion, a year-on-year increase of 47%; Allwinner: 2.29 billion, a year-on-year increase of 37%; 2. Gross Margin Rockchip: 38%, a year-on-year increase of 10%; Allwinner: 31%, a year-on-year decrease of 3.8%; 3. Net Profit Rockchip: Net profit of 600 million, a year-on-year increase of 341%; non-recurring profit of 540 million, a … Read more
1. Market Logic Behind Stock Price Fluctuations:AIoT Demand Explosion and Edge AI Technological Breakthroughs Since 2025, Rockchip (603893 ) has experienced significant stock price volatility. As of April 15, the closing price was 132.32 yuan, with a rolling price-to-earnings ratio (TTM ) reaching 118.2 times, significantly higher than the semiconductor industry average of 117.13 times. … Read more
1. Introduction The RK3588S is a high-performance, low-power application processor chip, featuring four Cortex-A76 and four Cortex-A55 cores along with an independent NEON coprocessor, suitable for tablets, VR, personal mobile internet devices, and other multimedia products. The RK3588S integrates various powerful embedded hardware engines, providing excellent performance for high-end applications, supporting 8K@60fps H.265 and VP9 … Read more
The Objective of This Article This article will practice the MobileNet image classification example in the RKNN Docker environment and deploy it to the RK3588 development board using the adb tool. For an introduction to MobileNet, please refer to the previous article. Development Environment Description Host System: Windows 11 Target Device: Android development board equipped … Read more
In the field of electronic manufacturing, underfill materials play a crucial role in ensuring the reliability of electronic devices. Today, we will delve into the IPC J-STD-030A standard document, providing a comprehensive understanding of the selection and application points for board-level underfill materials. Underfill Materials: The “Stabilizers” of Electronic Devices Underfill materials are primarily used … Read more
In the era of big data, the signal transmission rates of various devices, whether in data center solutions, automotive and industrial equipment, or everyday consumer electronics, are increasing at an unprecedented pace. For example, PCIe 6.0 has reached a transmission rate of 64Gbps; USB4 follows closely with a speed of 40Gbps; and the parallel bus … Read more
Follow+Star Public Account Number, don’t miss out on exciting contentSource | Internet When designing electronic circuits, practical experience is crucial, but it is built upon theoretical knowledge. Therefore, we still need to master some common electronic knowledge. The following organizes some common circuits, displayed in dynamic graphics. 1. Single-Phase Bridge Rectifier Circuit 2. Single-Phase Half-Wave … Read more
How does traditional plating address the “dog bone effect” and void defects when the aspect ratio of the interlayer vias exceeds 10:1? Technical Principles and Process Challenges Structural Characteristics of Blind and Buried Vias Definition Differences Blind Via: Connects outer layers to inner layers, typically 50-200μm deep Buried Via: Completely embedded within inner layers, aspect … Read more