Today, we share Goldman Sachs’ breakdown of China’s semiconductor ecosystem supply chain for your reference. Company data may be incomplete, and we welcome everyone to contribute in the comments:There is more exciting data on the planet, and we welcome everyone to join and learn~
China Semiconductor Ecosystem:
1. Software: (1) IP: Verisilicon, Actt, Akrostar, IPGoal, Brite Semi, C*Core, Innosilicon, Nuclei System, StarFive (2) Empyrean, X-Epic, Amedac, Primarius, SMIT, UNIVISTA, Xpeedic
The scale of China’s EDA market in 2024 is $2 billion, and the scale of China’s IP market in 2024 is $3 billion.
Materials:
(1) Silicon wafer: Wafer Works, NSIG, GRINM, Zhonghuan, AST, Simgui, Eswin
(2) SiC Substrate: SICC, TankeBlue
(3) Target: KFMI, GRINM
(4) Photomask: Qingyi, Newway, Longtu
(5) Photoresist: Kempur, Ruihong, Sinyang, Cyrstal Clear
(6) CMP Materials: Anji, Dinglong, Xinanna
(7) Gas: HUate Gas, Jinhong Gas, Guanggang, Nata
The scale of China’s materials market in 2024 is $13 billion.
2. IC Design:
1. Smartphone
(1) SoC: Hisilicon, Unisoc
(2) Display & Touch: Goodix, Chipone, Jiiov
(3) RF: Vanchip, Maxscend, EPIC MEMS, Smarter Micro
(4) CIS: Omnivision, GalaxyCore, Smartsens
2. Automotive
(1) SoC: Horizon, Robotics, Black Sesame, Axera
(2) MCU: Chipon, Autochips
(3) IGBT: BYD Semi, Starpower
(4) Ethernet: Aoxin, Motorcomm, JLSemi
3. Consumer Electronics / IoT
(1) SoC: Bestechnic, Avtions Tech, Amiogic, All Winner, Rockchip
(2) MCU: Espressif, SinoWealth
(3) Baseband: ASR
(4) CPU: Zhaoxin, Loongson, Hygon, Sunway, Bluetrum
(5) Interface IC: Novosense, Montage
4. Memory
(1) DRAM: Ingenic, TWSC
(2) NAND: Dosilicon
(3) NOR Flash: GigaDevice
(4) Controllers: YEESTOR, Maxio, Longsys, Puya
(5) GPU/NPU: Cambricon, T-Head, Jingjia Micro, Sugon, Biren, Moore, Threads
(6) FPGA: Anlogic, Gowin
5. Analog
(1) PMIC & Signal Chain: Chipown, INjoinic, SG Micro, 3PEAK, Chipsea, ETEK Micro, Hotchip
(2) Amplifier: Awinic
6. Network & Communication: Sanechips, BDStar, Centec
The scale of China’s IC design market in 2024 is $90 billion.
3. Equipment:
(1) Etching & Deposition: Naura, AMEC, Piotech, E-Town
(2) Lithography System / Components: SMEE, U-precision
(3) Metrology and Testing: Jingce, Skyverse, RSIC Scientific
(4) Ion Implantation: Kingstone, CETC, Sirui Intelligent, Naura
(5) Prober / Handler: Sidea, JHT Design
(6) Packaging Equipment: ASMPT, Nextool, GL Tech
(7) CMP: Hwatsing, Semicore
(8) Test Equipment: Accotest, HYC, ChangChuan, Powertech
(9) Coater/Developer: Kingsemi, TDsemi
(10) Cleaning: ACM Research, PNC
The scale of China’s semiconductor equipment market in 2024 is $50 billion.
4. IDM:
(1) Memory: CXMT, YMTC
(2) Optics: Everbright, YJ Semitech, Toptrans, Elite Opto
(3) Power Semis/Power Discrete: Sanan, Times Electric, Wingtech, CR Micro, Yangjie, JJMicro, Silan, Techsem, Sino-Micro, Innoscience, FMIC
The scale of IDM + Foundry in China in 2024 is $67 billion.
5. Foundry + OSAT:
(1) Foundry: SMIC, Hua Hong, GTA, CanSemi
(2) OSAT: JCET, Tongfu, Huatian
The scale of China’s OSAT market in 2024 is $57 billion.
Additionally, there are core forecast data for China’s wafer manufacturing equipment (WFE) market, a summary of China’s lithography equipment demand (2024-2035E), and predictions for China’s wafer demand (8″ equiv). Major manufacturers in the fields of domestic and foreign wafer fabs, OSAT, CIS, automotive chips, AI chips, etc., will have their R&D, product, and financial progress highlighted in 2024, emphasizing the advancements and breakthroughs of Chinese companies in 2.5D/3D packaging, AI chips, and automotive chips, as well as showcasing the evolution of ASML lithography machine technology. I have placed all related content on the planet, and I welcome everyone to exchange ideas.
