$60 Million! STMicroelectronics Invests in Panel-Level Packaging
This article is provided by the Semiconductor Industry Comprehensive (ID:ICVIEWS).STMicroelectronics is building a next-generation panel-level packaging(PLP) technology pilot production line at its factory in Tours, France. STMicroelectronics (ST) has announced plans to invest $60 million in a new pilot production line for next-generation panel-level packaging (PLP) technology at its factory in Tours, France. The new … Read more