AI Ignites the PCB Industry!
The upcoming core wave is worth paying attention to!
Amazon invests$11 billion to expand data centers, while Microsoft announces an $80 billion AI infrastructure investment plan, with tech giants pouring real money into computing infrastructure.
NVIDIA’s GB300 chip is set to go into mass production in the fourth quarter, with a new architecture increasing the value of multilayer boards made from hybrid PTFE materials by another 30%.
Moreover, the penetration rate of intelligent driving has surpassed 45%, with domain controllers, LiDAR, and other devices pushing the value of automotive PCBs to a peak of 3000 yuan, five times that of traditional fuel vehicles.
The PCB usage in the three electric systems (battery, electric drive, and electric control) of new energy vehicles has surged, driving the global automotive PCB market size to exceed $30 billion.
Apple’s AI smartphones are driving demand for SLP-type substrates, while Vision Pro ignites orders for AR device FPC flexible boards.
As global tech giants compete to lay out AI infrastructure, these circuit boards hidden in servers, cars, and smartphones are quietly reshaping the electronic industry landscape.
Six companies in the PCB field with “uniqueness”
1. Huadian Technology (002463)
Uniqueness Barrier: The only PCB manufacturer in China certified by NVIDIA for the GB200 server, with a global market share of 40% in AI server PCBs.
Technological Leadership: The leading market share in 800G switch PCBs, high-frequency and high-speed boards support 1.6T optical module transmission, with a yield rate exceeding 95%.
2. Founder Technology (600601)
Uniqueness Barrier: The only company in China to mass-produce 1.6T optical module PCBs, and the exclusive supplier of PCBs for NVIDIA’s GB300 AI chip.
Technological Breakthrough: Mass delivery of 800G optical modules, switch PCBs support 50Gbps signal transmission, breaking the overseas monopoly.
3. Shenzhen South Circuit (002916)
Uniqueness Barrier: The only company in China to mass-produce FC-BGA packaging substrates (used for HiSilicon Kirin chips), ranked eighth among global PCB manufacturers.
Technological Moat: Leading technology in 120-layer PCB backplane, communication server PCBs account for 60% of revenue, binding with Huawei and ZTE.
4. Chipbond Technology (688630)
Uniqueness Barrier: The leading domestic market share in PCB direct imaging equipment (DI), supporting 2μm line width substrate production.
Technological Empowerment: Equipment introduced to leading customers like Shenzhen South Circuit and Xingsen Technology, IC substrate direct writing lithography precision reaches international levels.
5. Zhongyi Technology (301150)
Uniqueness Barrier: Unique global mass production capability of 6μm high-frequency copper foil, with transmission loss 15% lower than the industry average.
Application Scenarios: Provides core materials for AI server/automotive radar PCBs, with clients including Huadian Technology and Shengyi Technology.
6. Shiyun Circuit (603920)
Uniqueness Barrier: The exclusive global supplier of PCBs for Tesla’s Dojo computing server, with over 30% of the Model Y battery management system PCBs.
Technological Adaptation: Automotive-grade PCBs certified by Bosch, with 80% of products exported to Europe and the United States, avoiding trade barriers.
In the face of new opportunities brought by these developments, investors and tech enthusiasts should keep their eyes wide open and seize this wave of potential wealth-changing opportunities!
Stay tuned for subsequent developments and the performance of related potential stocks.
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Risk Warning: Any opinions expressed herein are solely those of the author and do not constitute investment advice. Any actions taken based on this information are at your own risk. Investment carries risks; please proceed with caution!
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