Currently, in the electronic product processing industry, PCB boards are an essential electronic component. At present, PCB boards come in various types, such as high-frequency PCBs and microwave heating PCBs, which have gained a certain reputation in the market. PCB manufacturers have specific processing techniques for various types of materials.
Four Common Types of PCB Materials
1. FR-4
FR-4 is a flame-retardant material grade, which means that the resin material must be able to self-extinguish when burned. It is not a material name but a material grade. Therefore, there are many types of FR-4 materials used in general circuit boards, most of which are composite materials made from so-called Tera-Function epoxy resin combined with fillers and glass fiber.
2. Resin
Resin is a thermosetting material that can undergo polymerization reactions. The commonly used resin in the PCB industry is epoxy resin.
Functional Characteristics:
It has electrical insulation properties and can serve as an adhesive between copper foil and reinforcing materials (glass fiber cloth), with resistance to electricity, heat, chemicals, and moisture.
3. Glass Fiber Cloth
Glass fiber is an inorganic material that is fused at high temperatures and then cooled to form a non-crystalline hard material, which is woven from warp and weft yarns to create a reinforcing material.
Common specifications for E-glass fiber cloth include: 106, 1080, 3313, 2116, 7628.
4. Aluminum Baseboard
The substrate is aluminum, composed of copper foil, an insulating layer, and an aluminum sheet. It is now commonly used in the LED lighting industry due to its excellent heat dissipation properties.
In summary, the processing and manufacturing of PCB boards must consider three major aspects.
1. Selection of Materials
PCB materials can be broadly classified into organic and inorganic materials, each with its unique advantages. Therefore, the selection of material types must consider dielectric properties, types of copper foil, substrate thickness, and processability. Among these, the thickness of the surface copper foil is a primary factor affecting the characteristics of the printed PCB. Generally, the thinner the thickness, the more advantageous it is for the etching process and improving the precision of the patterns.
2. Setting of Production Processes
The environment of the PCB manufacturing workshop is also a crucial aspect. Control of temperature and humidity is particularly important. If the temperature changes too drastically, it may cause cracks in the plated holes on the board. If the humidity is too high, it adversely affects the properties of moisture-absorbent materials, primarily reflected in dielectric performance. Therefore, maintaining appropriate environmental conditions during PCB manufacturing is essential.
3. Selection of Production Processes
The manufacturing of PCBs is easily influenced by various factors. The number of layers, hole processing techniques, and surface plating processes can all affect the quality of the finished PCB. Therefore, the production environment for these processes must consider the characteristics of the manufacturing equipment, allowing for flexible adjustments based on the type of PCB and processing requirements.
In conclusion, when manufacturing PCBs, it is necessary to consider the selection of materials, the setting of production processes, and the selection of production processes. Additionally, the treatment of construction materials and the method of cutting materials are also aspects that require careful consideration, as they are closely related to the gloss of the finished printed circuit board.
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