On April 11, the China Semiconductor Industry Association issued an “Emergency Notice on the Rules for the ‘Origin’ Certification of Semiconductor Products.” According to the relevant regulations of the General Administration of Customs, the origin of “integrated circuits” is determined based on the four-digit tariff number change principle, meaning that the tape-out location is recognized as the origin. It is recommended that the origin of “integrated circuits,” whether packaged or unpackaged, be declared based on the location of the “wafer tape-out factory” during import customs clearance.Tape Out is a core step between integrated circuit (IC) design and actual mass production, referring to the trial production process that converts the designed circuit diagram into a physical chip. This process verifies the feasibility, performance, and manufacturing process stability of the chip design through small batch production (usually dozens to hundreds of pieces), which is a decisive step for the successful commercialization of the chip.
Today, I have summarized six core companies in the wafer foundry field that may directly benefit, for your reference and research. Special statement: The following content does not constitute any investment advice, guidance, or commitment, and is for academic discussion only.
First Company: SMIC (Semiconductor Manufacturing International Corporation)
Main Business:Integrated circuit wafer foundry, committed to creating a platform-based ecological service model, providing customers with design services and IP support, photomask manufacturing, and other one-stop supporting services, and promoting upstream and downstream collaboration in the integrated circuit industry chain, working with partners in various segments of the industry chain to provide customers with comprehensive integrated circuit solutions.
Core Highlights:One of the world’s leading integrated circuit wafer foundry companies, and the most technologically advanced, large-scale, and well-supported professional wafer foundry enterprise in mainland China, second only to Taiwan’s TSMC; provides 8-inch and 12-inch chip foundry and technical services to global customers, covering all categories including logic chips, memory chips, and analog chips; the first mainland wafer manufacturer capable of mass production at the 14nm FinFET node, having developed various technology nodes from 0.35Ξm to 14nm;
Second Company: Hua Hong Semiconductor
Main Business: Specialty process wafer foundry,primarily engaged in semiconductor wafer foundry business, classified under the “National Economic Industry Classification” (GB/T4754-2017) as the manufacturing industry of computers, communications, and other electronic devices (C39).
Company Highlights:Committed to continuous innovation in specialty process technology, independently developed a specialty process platform consisting of embedded/standalone non-volatile memory, power devices, analog and power management, logic and RF, achieving global leading levels in multiple fields. It is a member of the Hua Hong Group, which is an industrial group in China with advanced integrated circuit manufacturing mainstream process technologies of “8-inch + 12-inch.” A globally leading specialty process wafer foundry company, also the wafer foundry enterprise with the most comprehensive coverage of specialty process platforms in the industry.
Third Company: JCET (Jiangsu Changjiang Electronics Technology Co., Ltd.)
Main Business:12-inch wafer foundry business, dedicated to researching and applying industry-leading processes, providing customers with wafer foundry services across various process nodes and different process platforms.
Core Highlights: The ninth largest pure wafer foundry company globally, and the third largest in mainland China; controlled by the Hefei State-owned Assets Supervision and Administration Commission,has the technical capabilities for wafer foundry across various process platforms including DDIC, CIS, MCU, PMIC, MiniLED, E-Tag, etc. Currently has achieved mass production of 12-inch wafer foundry platforms at process nodes from 150nm to 90nm, and is conducting risk mass production for the 55nm process node. In the future, the issuer will utilize the funds raised from the listing to invest in the independent research and development of more advanced process platforms such as 40nm and 28nm, further enhancing advanced process service capabilities and broadening product structure.
Fourth Company: Silex Microsystems
Main Business:Engaged in wafer foundry and packaging testing services in the fields of MEMS and power devices, providing customers with one-stop service foundry manufacturing solutions.
Core Highlights: The tenth largest pure wafer foundry company globally, and the fourth largest in mainland China; originated from the power device and MEMS division of SMIC; the largest domestic foundry enterprise for automotive-grade IGBT chips and modules;one of the few wafer foundry companies in China currently providing automotive-grade chips, with sales and marketing offices in Shanghai, Shenzhen, Hefei, Tokyo, Japan, and Switzerland, Europe. Silex Microsystems has established extensive strategic cooperation with numerous domestic and foreign customers, continuously collaborating to develop technologically advanced products based on supporting customers’ large-scale production.
Fifth Company: China Resources Microelectronics
Main Business: IDM model, wafer foundry,China’s leading semiconductor company with integrated capabilities in chip design, wafer manufacturing, packaging, and testing, focusing on power semiconductors, smart sensors, and smart control fields, providing customers with a rich array of semiconductor products and system solutions.
Core Highlights: The largest IDM model semiconductor company in China; the largest MOSFET manufacturer in terms of revenue in China;the leading semiconductor enterprise in China with integrated operational capabilities across the entire industry chain;has the largest open, technologically advanced, and capacity-leading photomask factory in China;the self-developed medium and low voltage trench MOS, SJMOS, SBD, FRD, IGBT process platforms and corresponding modules and system application solutions are at the leading level in China.
Sixth Company: SAI Microelectronics
Main Business: Process development and wafer manufacturing, foundry of MEMS chips,a globally leading, internationally operated high-end integrated circuit wafer foundry manufacturer, also a specialty process wafer manufacturer in China with independent intellectual property rights and core semiconductor manufacturing technologies.
Core Highlights: Its subsidiary, Silex, is a leading enterprise in the global MEMS pure foundry field; positioned in the first tier of global MEMS wafer foundry, representing the mainstream technology level in the industry;has multiple pilot platforms and mass production factories both domestically and internationally, with business spanning the globe, serving internationally renowned companies in DNA/RNA sequencing, photolithography machines, computer networks and systems, silicon photonics, infrared, wearable devices, new medical devices, automotive electronics, and leading enterprises in various sub-sectors, covering a wide range of products in communications, biomedical, industrial automotive, consumer electronics, and many other fields.
The reconstruction of origin rules is not only a breakthrough in trade barriers but also a key turning point for the Chinese semiconductor industry chain from “following” to “leading.” In the next three years, domestic substitution will shift from “optional” to “mandatory,” and chip foundry will become increasingly important. It is recommended to focus on technological breakthroughs and the pace of capacity release.
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