Xiaomi SU7 cars have indeed attracted a lot of attention recently. Lei Jun’s sincerity is not only evident in the details of taking photos with car owners during the first day of delivery but also in the materials used in the car’s circuit board.
I like the blogger Yang Changshun, although calling him Master Yang Changshun is somewhat funny. But he is genuinely hardcore, from the Mate 60 Pro to the Xiaomi Su7.
1. Intelligent Driving Main Control
Let’s first look at the intelligent driving main control, which uses a water cooling method. This is not difficult to understand, especially for friends engaged in machine learning.
Figure 1 shows that the circuit board has undergone a three-proof treatment, which effectively isolates the circuit board and protects the circuits from moisture, salt spray, and mold erosion from the environment. This practice helps ensure the stability and safety of the circuit board, improving the reliability and durability of the product. The three-proof treatment is particularly important in the field of automotive electronics, as cars operate in various harsh environments such as rain, salt, and high humidity. By adopting three-proof treatment, the lifespan of automotive electronic devices can be effectively extended, reducing failure rates and enhancing user experience.
Figure 2 Left Tesla; Right Xiaomi
Figure 3 Computing Power Chip
The two computing power chips in the image are indeed very eye-catching. The chips are NVIDIA’s Orin X computing power chips, released in 2019 and began mass production in 2022, using a 7nm process with a power consumption of 45W.
Based on the code printed as “2347A1”, it can be inferred that these chips were likely produced in the 47th week of 2023.
The Orin X chip has a computing power of up to 254 TOPS, meaning it can perform 254 trillion calculations per second. The Xiaomi SU7 Max uses two such chips, resulting in a total computing power of 508 TOPS.
The Orin X chip is currently one of the most widely used high-end intelligent driving main control chips. Not only does the Xiaomi SU7 Max use this chip, but it is also used in other models such as NIO ET7, Xpeng G9, Leapmotor C10, Zhiji L7/LS6, and Geely Zeekr 007. Its application is not limited to in-vehicle systems but can even be used in battery swap stations. The fourth-generation battery swap station released by NIO at the end of last year uses four NVIDIA Orin X chips, reportedly reducing the battery swap time by 22%. This demonstrates the wide application and excellent performance of this chip in the intelligent driving field.
2 Intelligent Driving Main Control
Figure 4 Controller produced by Desay SV
The main control of the Xiaomi SU7 Max car machine uses the Qualcomm Snapdragon 8295 chip, equipped with four 8295AU power chips to drive it. This platform was released on January 27, 2021, with a CPU computing power of 230K DMIPS.
DMIPS is an indicator of processor performance, describing the number of integer operations that can be processed per second. 230K DMIPS is equivalent to processing 230,000 million calculations per second. This performance level is comparable to the Intel Core i5 1135 G7 known on the PC side.
In addition, the platform’s GPU computing power reached 2.9 TFLOPS (32-bit) and 5.8 TFLOPS (16-bit), which is comparable to the performance of NVIDIA’s flagship GPU 1080Ti at the time.
These performance indicators demonstrate the powerful performance of the Xiaomi SU7 Max car machine main control platform in processing and graphics processing, providing efficient computing and graphics processing capabilities for the in-vehicle system.
Figure 6 Temperature during no load
Figure 6
QCA6595 is a combination chip for Wi-Fi 5 and Bluetooth,
QCA6595AU is part of Qualcomm’s automotive Wi-Fi chip series, designed to meet the growing demand for in-car connectivity. It can achieve a throughput rate of 1Gbps, supplementing Qualcomm’s automotive Wi-Fi 6 dual MAC chip QCA6696 (with a throughput rate of nearly 1.8Gbps) and Wi-Fi 5 single MAC chip QCA6574AU (with a throughput rate of up to 867Mbps).
The chip adopts a 2×2 MIMO (multiple input multiple output) 5 GHz and 1×1 SISO (single input single output) 2.4GHz dual-band concurrent operation mode. This combination can not only provide high-speed 5GHz Wi-Fi connection for the entire vehicle but also support traditional 2.4GHz devices and high-quality Bluetooth connections simultaneously. Additionally, the QCA6595AU can connect up to 32 client devices and offers enhanced security through the WPA3 protocol.
Overall, as part of Qualcomm’s automotive Wi-Fi chip series, the QCA6595AU features high speed, stability, and security, meeting the growing demand for in-car connectivity.
Images sourced from Yang Changshun Repair Home
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