Powerful Disassembly of Xiaomi SU7 Automotive Board

I like the blogger Yang Changshun. Although it’s a bit funny to call him Master Yang Changshun, he is truly hardcore, having disassembled everything from the Huawei Mate 60 Pro to the Xiaomi SU7.

1. Intelligent Driving Main Control

Let’s first take a look at the Xiaomi SU7 intelligent driving main control, which uses a liquid cooling method. This is not difficult to understand, especially for friends engaged in machine learning.

Figure 1 Mainboard photo

Figure 1 shows that the board has undergone a three-proof treatment, which effectively isolates the circuit board and protects the circuits from damage due to moisture, salt spray, and mold. This approach helps ensure the stability and safety of the circuit board, enhancing product reliability and durability. The three-proof treatment is particularly important in the automotive electronics field, as vehicles operate in various harsh environments such as rain, salt, and high humidity. By adopting three-proof treatment, the lifespan of automotive electronic devices can be effectively extended, reducing failure rates and improving user experience.

Figure 2 Left: Tesla, Right: Xiaomi

Figure 3 Computing power chip

The two computing power chips in the image are indeed very eye-catching. The chips are NVIDIA’s Orin X computing power chips, released in 2019 and mass-produced starting in 2022, using a 7nm process with a power consumption of 45W.

Based on the code printed on the chips, “2347A1”, it can be inferred that these chips were likely produced in the 47th week of 2023.

The Orin X chip can achieve a computing power of 254 TOPS, which means it can perform 254 trillion calculations per second. The Xiaomi SU7 Max uses two of these chips, resulting in a total computing power of 508 TOPS.

The Orin X chip is currently one of the most widely used high-end intelligent driving main control chips. Not only does the Xiaomi SU7 Max use this chip, but other models such as NIO ET7, XPeng G9, Leapmotor C10, Zhiji L7/LS6, and Geely Zeekr 007 also utilize this chip. Its application is not limited to onboard systems; it can even be used in battery swapping stations. NIO’s fourth-generation battery swapping station, released at the end of last year, uses four NVIDIA Orin X chips, reportedly reducing battery swapping time by 22%. This demonstrates the widespread application and outstanding performance of this chip in the intelligent driving field.

2. Intelligent Driving Main Control

Figure 5

The Xiaomi SU7 Max’s vehicle machine main control uses the Qualcomm Snapdragon 8295 chip, equipped with four 8295AU power chips to drive it. This platform was released on January 27, 2021, with a CPU computing power of 230K DMIPS.

DMIPS is an indicator of processor performance, describing the number of integer operations that can be processed per second. 230K DMIPS is equivalent to 230,000 computations per second. This performance level is comparable to the Intel Core i5 1135 G7 known on PCs.

In addition, the platform’s GPU computing power reaches 2.9 TFLOPS (32-bit) and 5.8 TFLOPS (16-bit), which is comparable to the performance of NVIDIA’s flagship GPU 1080Ti.

Figure 6 Temperature at no load

Figure 7

QCA6595 is a Wi-Fi 5 and Bluetooth combo chip, QCA6595AU is part of Qualcomm’s automotive Wi-Fi chip series, designed to meet the growing demand for in-car connectivity. It can achieve a throughput rate of 1Gbps, complementing Qualcomm’s automotive Wi-Fi 6 dual MAC chip QCA6696 (throughput rate nearly 1.8Gbps) and Wi-Fi 5 single MAC chip QCA6574AU (throughput rate up to 867Mbps).

The chip uses a 2×2 MIMO (Multiple Input Multiple Output) 5 GHz and 1×1 SISO (Single Input Single Output) 2.4GHz dual-band concurrent working method. This combination not only provides high-speed 5GHz Wi-Fi connectivity for the vehicle but also supports traditional 2.4GHz devices and high-quality Bluetooth connections simultaneously. At the same time, QCA6595AU can connect up to 32 client devices and offers enhanced security through the WPA3 protocol.

In summary, as part of Qualcomm’s automotive Wi-Fi chip series, QCA6595AU possesses high-speed, stable, and secure characteristics, meeting the growing demand for in-car connectivity.