Recently, the Chongqing Municipal Government released the list of key municipal projects for 2025.
In 2025, the key municipal projects in Chongqing include four categories: projects that have started, are under construction, have been completed, and those that are in reserve. Among them, there are a total of 1,252 projects with a total investment of approximately 3.2 trillion yuan, and an annual planned investment of 480 billion yuan; there are 316 reserve projects with a total investment of about 1.2 trillion yuan.
From the perspective of industry sectors, the key municipal projects in Chongqing are focused on the deployment of the “six zones and one highland” task, covering nearly 20 industry sectors including manufacturing, technological innovation, infrastructure, and social welfare.
Among them, there are nearly 30 projects related to the semiconductor industry, including the Wanzhou semiconductor device module industrialization project, the Chongqing YN Silicon Carbide module production base project, the Fuling 6-inch IGBT power semiconductor production line project, the Banan Qixin project, the Chongqing High-tech Zone AOSONG Semiconductor 8-inch MEMS specialty chip IDM industrial base, the Chongqing High-tech Zone 12-inch integrated circuit specialty process line (Phase I), the Chongqing High-tech Zone STMicroelectronics 8-inch silicon carbide epitaxy and chip project, and the Peking University Chongqing Carbon-based Integrated Circuit Research Institute.
Chongqing High-tech Zone STMicroelectronics 8-inch Silicon Carbide Epitaxy and Chip Project
In June 2023, Sanan Optoelectronics and STMicroelectronics jointly announced the establishment of an 8-inch silicon carbide wafer joint manufacturing plant (i.e., STMicroelectronics) in Chongqing, with a total investment expected to be around 23 billion yuan (approximately 3.2 billion USD) upon full completion.
It is reported that Chongqing Sanan Semiconductor Co., Ltd. (Chongqing Sanan), located in the same park, will provide 8-inch silicon carbide substrates for the joint plant, while packaging and testing will be completed at STMicroelectronics’ domestic factory, forming a complete localized 8-inch silicon carbide supply chain in China.
Currently, the joint plant officially commenced operations in February this year and is expected to start production in the fourth quarter of 2025, becoming the first domestic 8-inch automotive-grade silicon carbide power chip mass production line.
Fuling 6-inch IGBT Power Semiconductor Production Line Project
The Fuling 6-inch IGBT power semiconductor production line project is invested and constructed by Chongqing Xinling Microelectronics Co., Ltd.
This project plans to build a 6-inch automotive-grade wafer production line with a 70-micron ultra-thin back process and front Trench technology. The main products include IGBT, MOSFET, and other power semiconductor chips, which will be applied in fields such as new energy vehicles, smart grids, photovoltaic energy storage, wind power generation, industrial applications, and white goods.
It is reported that Chongqing Xinling Microelectronics Co., Ltd. was established in July 2022, with a registered capital of 200 million yuan, jointly invested by Ningbo Daxin Semiconductor Co., Ltd. and Fuling District New City Development (Group) Co., Ltd. It is a high-tech enterprise engaged in the manufacturing of power semiconductor chips.
According to the “Fuling High-tech Zone Comprehensive Bonded Zone” introduction in January this year, it is expected to achieve full line operation and trial production in the second quarter, and after reaching full production in 2027, it will produce approximately 1.2 million 6-inch wafers annually, helping to meet the urgent domestic demand for high-end power semiconductor chips.
Chongqing High-tech Zone AOSONG Semiconductor 8-inch MEMS Specialty Chip IDM Industrial Base
The AOSONG Semiconductor 8-inch MEMS specialty chip IDM industrial base project officially settled in Chongqing in February 2023 and started construction in June of the same year.
This project has a total investment of 3.5 billion yuan, covering an area of approximately 230 acres, and includes an 8-inch CMOS+MEMS specialty sensor chip mass production line, an 8-inch MEMS specialty wafer rapid R&D line, an intelligent sensor innovation R&D center, an automotive-grade sensor reliability testing center, a production, learning, and research center, and the AOSONG Semiconductor R&D office building, among other construction projects. The technical capabilities cover CMOS+MEMS specialty processes, enabling the R&D and mass production of various MEMS sensor products.
The project leader of AOSONG Semiconductor previously stated that it is expected to start production in mid-2025. By then, the base will comprehensively carry out the R&D and mass production of surface silicon, bulk silicon, as well as new processes, new devices, and new systems, with R&D and mass production equipment for MEMS piezoresistive, piezoelectric, silicon photonics, magnetic materials, MOX, microfluidics, and other related processes, significantly improving the success rate of product R&D, enabling a seamless transition from R&D to mass production for various MEMS semiconductor sensor products.
Wanzhou Semiconductor Device Module Industrialization Project
The Wanzhou semiconductor device module industrialization project has a total investment of 900 million yuan and is implemented by Chongqing Xianyue Optoelectronics Technology Co., Ltd., a subsidiary of the Xian Dao Group.
This project covers an area of 29 acres and, once completed, will have an annual production capacity of 50 million laser package units and 25 million module products, achieving an annual output value of over 1 billion yuan and paying over 100 million yuan in taxes, creating 500 jobs.
Chongqing YN Silicon Carbide Module Production Base Project
The Chongqing YN Silicon Carbide module production base project has a total investment of 1.8 billion yuan and is a major project in the new generation of electronic information manufacturing industry that started this year.
It is reported that this project will build a production line with a monthly capacity of 730,000 silicon carbide modules, with products widely used in electric vehicles, new energy, and industrial sectors.
According to the Chongqing Planning and Natural Resources Bureau’s official website, this project obtained the construction land planning permit on December 5, 2024, and the construction unit is Chongqing YN Electronics Co., Ltd. According to Qichacha, YN Electronics was established in September 2023, with a business scope including the manufacturing of power electronic components and semiconductor discrete devices, with the main shareholder being Beijing Yiswei Technology Group Co., Ltd.
Chongqing Photomask Manufacturing Project
The Chongqing photomask manufacturing project is invested and constructed by Chongqing Mite Optoelectronics Co., Ltd., with a total investment of 2.2 billion yuan, and is planned to achieve full-load production by 2027. Once fully operational, it is expected to have an annual production capacity of approximately 2,250 photomask products, with an output value reaching 700 million yuan.
Chongqing Mite Optoelectronics Co., Ltd. was jointly established by HOYA Corporation and BOE Technology Group, and is the first large-scale photomask production equipment investment project in the inland region of China. According to the “Two Rivers New Area Management Committee,” this project is expected to officially start production on December 10, 2024.
Peking University Chongqing Carbon-based Integrated Circuit Research Institute
The Peking University Chongqing Carbon-based Integrated Circuit Research Institute is a research institution of Peking University located in another region and a new type of research and development institution in Chongqing.
This research institute focuses on national strategic needs in integrated circuits, artificial intelligence, and next-generation information technology, relying on internationally leading original carbon-based integrated circuit technology and Peking University’s first-class R&D team to build a national-level integrated circuit innovation R&D platform, establishing an advanced integrated circuit and electronic component R&D center, driving the upgrade of the integrated circuit industry in the central and western regions and even nationwide.
It is understood that in the next 5-10 years, the research institute will mainly carry out the engineering promotion and application technology breakthroughs of carbon-based integrated circuits, engaging in advanced manufacturing of carbon-based integrated circuits, three-dimensional integrated circuits, and RF SoC chip technological innovation and application technology development, incubating a full-chain industrial ecosystem for carbon-based integrated circuits, driving the development of a hundred billion-level upstream and downstream industries, and providing support for the sustainable development of China’s integrated circuit industry and the construction of a scientific city in the west.
Chongqing Seizes the High Ground in the Integrated Circuit Industry
Chongqing is an important industrial base in western China. In recent years, it has rapidly risen to become a “new force” in the national integrated circuit industry map, focusing on “power semiconductors” as a core breakthrough, leveraging advantages in the automotive and electronic information industries, and accelerating towards the goal of becoming the “Western Chip City” through policy guidance, full industrial chain layout, and the implementation of major projects.
In terms of integrated circuit industry layout, Chongqing has gathered over 80 key enterprises, including China Resources Microelectronics, SK Hynix, China Electronics Technology Group Chip Company, Universal Semiconductor, Chongqing Super Silicon, Chip Union Microelectronics, Sanan Optoelectronics, and STMicroelectronics, and has created a complete industrial chain layout from “chip design – wafer manufacturing – packaging testing – equipment and materials”.
In addition to the projects mentioned above, Chongqing has also made new progress in several semiconductor industry projects. For example, the monthly production capacity of China Resources Microelectronics’ 12-inch production line in Chongqing has reached 30,000 wafers, and the Chongqing packaging and testing base is in a rapid ramp-up phase; the national standard for “Semiconductor Integrated Circuits – RF Transmitter/Receiver Testing Methods” led by the Southwest Design of the Electronics Technology Group was officially implemented recently…
According to the plan, by 2027, the revenue of the integrated circuit design industry in Chongqing will exceed 12 billion yuan; more than 100 new integrated circuit design companies will be established, including at least one company with revenue exceeding 500 million yuan and at least four companies with revenue exceeding 200 million yuan; the revenue of the integrated circuit packaging and testing industry in the city will exceed 20 billion yuan; more than 10 new integrated circuit packaging and testing companies will be established, including at least two companies with revenue exceeding 500 million yuan.
Looking at the development of the integrated circuit industry across the country, the rise of Chongqing is not only a microcosm of the transformation and upgrading of the western industry but also an important support point in the process of semiconductor localization in China. With policy dividends, capital support, and deep integration of industrial ecology, Chongqing is transforming from a traditional manufacturing hub into a globally competitive “Western Semiconductor Capital,” injecting new momentum into the global semiconductor landscape.
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