Analysis of the Principles and Advantages of Plasma for De-Soldering in Printed Circuit Boards (PCBs)
PCB (Printed Circuit Board) industry has increasingly recognized the plasma de-soldering technology due to its environmental friendliness, efficiency, and excellent uniformity. It is primarily used in processes such as desmear before hole metallization, removal of dry film/wet film residues, surface cleaning, and activation, significantly enhancing the reliability and yield of PCB products, especially for high-precision … Read more