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What is tape-out?
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Tape-out refers to the process of manufacturing chips through a series of steps on a production line. It is the final stage of integrated circuit design, known as “trial production.” In simple terms, after the circuit design is completed, a small batch is produced for testing. If the tests pass, large-scale production can begin based on these conditions.
-
Tape-out is the process of turning the layout into an ASIC chip. After a fabless manufacturer designs the circuit and all checks and validations are correct, the final layout (GDSII) file is sent to the fab to produce a small number of sample chips (usually ranging from dozens to hundreds) to verify whether the process steps are feasible and whether the circuit meets the required performance and functionality.
How much does a tape-out cost? Why?
-
The cost of tape-out varies depending on the process technology, design complexity, and production scale.
The high cost of tape-out is mainly due to the following reasons:
-
Mask costs: Masks are critical components in the photolithography process that transfer the design patterns onto the wafer, and they represent a significant portion of the cost. A set of masks can cost millions of dollars, especially in advanced processes.
-
Manufacturing a chip requires hundreds or even thousands of steps, and there are usually multiple layers of masks. For example, a 28nm process may require about 40 layers, a 14nm process about 60 layers, and a 7nm process about 80 layers or more. The price of masks mainly depends on the “process node” chosen for the chip; the higher the process node, the more expensive the tape-out. Generally, the more advanced the process node, the more mask layers are required, leading to higher mask costs.
-
Wafer foundry costs: Wafer foundry involves complex processes, including photolithography, etching, doping, etc., each requiring highly precise control, resulting in high operational costs.
-
Equipment depreciation: Semiconductor manufacturing equipment is expensive and requires regular depreciation. For instance, a mask lithography machine for 28nm costs over $50 million.
-
Non-mass production: Tape-out is a small-batch production model, lacking the economic effects of large-scale production. The smaller the scale, the higher the average cost per chip; the larger the scale, the lower the average cost per chip.
How long does tape-out take?
-
The tape-out process typically takes 3 to 6 months, depending on the complexity of the chip design, the advancement of the process technology, and the capacity of the foundry. The entire process includes raw material preparation, photolithography, doping, deposition, packaging, testing, and involves hundreds of steps.
The economic effects behind tape-out
-
The high cost of tape-out is due to the need to spread the high costs of masks and equipment over small-batch production. For example, under a 40nm process, the total cost of small-scale tape-out may range from $300,000 to $500,000, with most of it being mask costs. Once entering mass production, wafer costs become the main source of costs, significantly reducing the cost per chip.
Additionally, a failed tape-out can lead to significant economic losses, potentially causing a company to go bankrupt.
What is tape-out?
-
Tape-out refers to the process of manufacturing chips through a series of steps on a production line. It is the final stage of integrated circuit design, known as “trial production.” In simple terms, after the circuit design is completed, a small batch is produced for testing. If the tests pass, large-scale production can begin based on these conditions.
-
Tape-out is the process of turning the layout into an ASIC chip. After a fabless manufacturer designs the circuit and all checks and validations are correct, the final layout (GDSII) file is sent to the fab to produce a small number of sample chips (usually ranging from dozens to hundreds) to verify whether the process steps are feasible and whether the circuit meets the required performance and functionality.
How much does a tape-out cost? Why?
-
The cost of tape-out varies depending on the process technology, design complexity, and production scale.
The high cost of tape-out is mainly due to the following reasons:
-
Mask costs: Masks are critical components in the photolithography process that transfer the design patterns onto the wafer, and they represent a significant portion of the cost. A set of masks can cost millions of dollars, especially in advanced processes.
-
Manufacturing a chip requires hundreds or even thousands of steps, and there are usually multiple layers of masks. For example, a 28nm process may require about 40 layers, a 14nm process about 60 layers, and a 7nm process about 80 layers or more. The price of masks mainly depends on the “process node” chosen for the chip; the higher the process node, the more expensive the tape-out. Generally, the more advanced the process node, the more mask layers are required, leading to higher mask costs.
-
Wafer foundry costs: Wafer foundry involves complex processes, including photolithography, etching, doping, etc., each requiring highly precise control, resulting in high operational costs.
-
Equipment depreciation: Semiconductor manufacturing equipment is expensive and requires regular depreciation. For instance, a mask lithography machine for 28nm costs over $50 million.
-
Non-mass production: Tape-out is a small-batch production model, lacking the economic effects of large-scale production. The smaller the scale, the higher the average cost per chip; the larger the scale, the lower the average cost per chip.
How long does tape-out take?
-
The tape-out process typically takes 3 to 6 months, depending on the complexity of the chip design, the advancement of the process technology, and the capacity of the foundry. The entire process includes raw material preparation, photolithography, doping, deposition, packaging, testing, and involves hundreds of steps.
The economic effects behind tape-out
-
The high cost of tape-out is due to the need to spread the high costs of masks and equipment over small-batch production. For example, under a 40nm process, the total cost of small-scale tape-out may range from $300,000 to $500,000, with most of it being mask costs. Once entering mass production, wafer costs become the main source of costs, significantly reducing the cost per chip.
Additionally, a failed tape-out can lead to significant economic losses, potentially causing a company to go bankrupt.
Source:Semiconductor Packaging Engineer Community
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【Disclaimer】The article represents the author’s independent views and does not reflect the position of automotive semiconductors. If there are issues regarding the content or copyright, please contact automotive semiconductors at 13866369365 within 30 days of publication for deletion or copyright negotiation.