▲ Click the image to see the details of the competition
The integrated circuit packaging and testing industry is an indispensable part of the entire semiconductor industry chain and is becoming increasingly important in the semiconductor industry. Following the release of the “National Integrated Circuit Industry Development Outline”, China has accelerated its industrial layout. Besides wafer manufacturing, packaging and testing, as a key link in the latter part of the integrated circuit industry chain, has also seen rapid development. In 2015, with the support of the National Integrated Circuit Industry Investment Fund (referred to as the “Big Fund”), Jiangsu Changjiang Electronics Technology Co., Ltd. acquired the fourth-ranked packaging and testing company in the world, STATS ChipPAC, while Tongfu Microelectronics acquired two packaging and testing plants from AMD.
The packaging and testing industry in mainland China is rapidly growing and has become one of the top three in the global packaging and testing industry.
Here is a brief introduction:
1. ASE (Acquired Siliconware Precision Industries)
Main business: semiconductor packaging and testing, front-end chip testing, wafer probing, back-end packaging, materials, and finished product testing.
Website: http://www.aseglobal.com/
Siliconware Precision Industries (Suzhou) Co., Ltd.
Headquarters: Suzhou
Main business: engaged in the manufacturing, processing, trading, and testing of various integrated circuit packaging.
Website: http://www.spil.com.cn/
2. Amkor (Acquired J-devices)
Main business: semiconductor packaging and testing outsourcing services.
Website: http://www.amkor.com/
J-devices
Headquarters: Japan
Main business: backend manufacturing of semiconductor devices (wafer testing, assembly, and final testing).
Website: http://j-devices.co.jp/
3. Jiangsu Changjiang Electronics Technology Co., Ltd. (Acquired STATS ChipPAC)
Main business: diodes, Schottky rectifiers, transistors, Darlington transistors, digital transistors, voltage regulator circuits, thyristors, MOSFETs, energy-saving lamp charger switches, and composite tubes.
Main clients: Spreadtrum, RDA, HiSilicon, Leadcore, Rockchip, etc.
Website: http://www.cj-elec.com/
STATS ChipPAC (Acquired by Changjiang Electronics Technology)
Headquarters: Singapore
Main business: semiconductor packaging and testing.
Website: http://www.statschippac.com/
4. Powertech Technology Inc. (Acquired domestic second-tier packaging and testing leader Chao Feng)
Main business: memory IC packaging and testing, multi-chip packaging, microSD packaging.
Main clients: Powerchip, Nanya, Kingston, Intel, Hynix, Elpida, Toshiba, and American SST.
Website: http://www.pti.com.tw
5. UTAC (United Test and Assembly Center)
Main business: UTAC Semiconductor (Shanghai) Co., Ltd. is a subsidiary of the renowned Singapore-listed company UTAC Holdings, established in the Shanghai Pudong Waigaoqiao Free Trade Zone. The company develops a CMW strategy based on the needs of the Chinese electronics market, which includes three major product applications: Consumer Electronics, Memory, and Wireless.
Website: http://www.utacgroup.com/
6. ChipMOS Technologies Inc.
Main business: packaging and testing of high-frequency, high-density memory products and communication ICs in the backend processing of IC semiconductors.
Website: http://www.chipmos.com
7. Chipbond Technology Corp.
Main business: tape carrier packaging (TCP), tape film packaging (COF), glass packaging.
Website: http://www.chipbond.com.tw
8. Huada Semiconductor Co., Ltd.
Main business: packaging and testing products include 12 major series with over 200 varieties, with an annual packaging capacity of 10 billion integrated circuits. The company’s annual packaging capacity and sales revenue rank second among publicly listed companies in the same industry in China.
Main clients: Silan Microelectronics, Zhuhai Juhua, Haier, Shanghai Beiling, Wuxi Huaren Silicon Technology, etc.
Website: http://www.tshtkj.com
9. Nantong Fujitsu Microelectronics Co., Ltd.
Main business: successfully developed WLCSP, BGA, BUMP, high-reliability automotive electronics, and other products and technologies that are leading domestically.
Website: http://www.fujitsu-nt.com
10. Kyec
Main business: wafer probing, IC finished product testing, wafer grinding/cutting/chip picking.
Website: http://www.kyec.com.tw/en/
12. Unisem
Main business: a global provider of semiconductor assembly and testing services, such as chip bumping, wafer, wafer grinding, a wide range of lead frames, and substrate integrated circuit packaging, wafer-level CSP and RF, analog, digital, and mixed-signal testing services.
Website: http://www.unisemgroup.com/
13. Foma Technology
Main business: primarily engaged in DRAM packaging and testing, with some business involving module shipments. Foma Technology Main clients: including DRAM manufacturers such as Nanya and Winbond, and also ships to module distributors such as ADATA and IC design companies like, Winbond
Website: http://www.fatc.com.tw/
15. Shenzhen Siga Semiconductor Technology Co., Ltd.
Main business: IC packaging and testing for LED drivers, power supplies, communications, storage, and photonic integrated circuits.
Website: http://www.siga.cc/
16. Suzhou Jingfang Semiconductor Technology Co., Ltd.
Main business: image sensors, biometric identification, ambient light sensing, medical electronics, and automotive sensors.
Website: http://www.wlcsp.com/
17. Wuxi China Resources Ansheng Technology Co., Ltd.
Main business: a subsidiary of China Resources Microelectronics, focusing on providing the most options for integrated circuit packaging/testing solutions for semiconductor chip designers and wafer manufacturers both domestically and internationally.
Website: http://www.anst.com.cn/
18. Carsem Semiconductor
Main business: semiconductor packaging and testing services.
Website: http://www.carsem.com/
19. Wuxi Huajin Semiconductor Packaging Leading Technology Research and Development Center Co., Ltd.
The company was jointly established by the Institute of Microelectronics of the Chinese Academy of Sciences and leading integrated circuit packaging and testing companies, including Changjiang Electronics Technology, Tongfu Microelectronics, Huada Technology, and Shenzhen South Circuit. Currently, there are ten shareholders.
Website: http://www.ncap-cn.com/
21. Suzhou Rihua Semiconductor Co., Ltd.
Main business: a semiconductor packaging and testing factory established in 2007 through cooperation between NXP Semiconductors and ASE Group.
22. Shenzhen Biwin Storage Technology Co., Ltd.
Main business: semiconductor packaging testing, SiP packaging, wafer grinding, thinning, cutting, and finished product testing; provides LGA packaged Smart Watch chips, wireless charging modules, WIFI modules, Bluetooth modules, and OEM services.
Website: http://www.biwin.com.cn/
23. Beijing Shougang Microelectronics Co., Ltd. (BSMC)
Main business: engaged in large-scale integrated circuit design, manufacturing, packaging, and testing.
Main clients: NEC, Midea, Toyota, Gree, Panasonic, Sony, etc.
Website: http://www.bsmc.com.cn/
24. Chizhou Huatai Semiconductor Co., Ltd. (NationT)
Main business: focuses on high-end manufacturing of large-scale integrated circuit testing and packaging. Annual packaging testing capacity: 1 billion integrated circuit blocks. Packaging forms include DIP series, SOP series, TSSOP series, SSOP series, SOT series, TO series, QFP series, QFN series, etc. Major processes include wafer acceptance inspection, wafer thinning, wafer cutting, chip placement (die bonding), silver paste curing, wire bonding, molding, baking, electroplating (tin plating), laser marking, cutting, bending, appearance inspection, finished product testing, and packaging and shipment.
Website: http://www.nationt.com.cn/
25. Chipmore Technology (Suzhou) Co., Ltd.
Main business: mainly engaged in the manufacturing and sales of bumps (gold bumps) and provides backend tape film packaging (COF), glass packaging (COG) services. Products are mainly used in LCD driver IC.
Website: http://www.chipmore.com.cn/
26. Ningbo Xinjian Semiconductor Co., Ltd.
Main business: focuses on wafer-level chip-size packaging (Wafer Level CSP) and copper bump packaging (FC-Bumping) and related businesses, providing customers with complete solutions for wafer testing, packaging design, and packaging testing.
Website: http://www.chipex.cn/
27. Shenzhen Comtech Technology Co., Ltd.
Main business: a foreign-invested enterprise established by the Russian AFK SISTEMA Group’s MIKRON Group. The company mainly undertakes packaging and testing services for SOP7, SOP8, SOP14, SOP16, SOP28, TSSOP20, SSOP24, SOT23-3/5/6, DIP7, DIP8, and other package types.
Website: http://www.cw-sz.cn/
28. Jiangsu Xinchao Technology Group Co., Ltd.
Main business: Jiangsu Xinchao Technology was established in 2000, originally founded as Jiangyin Transistor Factory in 1972. The business involves integrated circuit packaging testing, semiconductor chip, and smart instrument development, production, and sales.
Website: http://www.xcgp.com/
29. RFMD (Beijing) Co., Ltd.
Main business: mainly engaged in the packaging testing of integrated circuit components and supporting local customers in China.
Website: http://www.rfmd.com
30. Nantong Huada Microelectronics Group Co., Ltd.
Main business: Nantong Huada Microelectronics was established in 2007, originally founded as Nantong Transistor Factory in 1966, mainly engaged in the packaging, testing, and sales of semiconductor devices.
Website: http://www.nthuada.com/
31. Freescale Semiconductor (China) Co., Ltd.
Main business: Freescale Semiconductor (China) was established in 1992, with a packaging testing factory in Tianjin, one of the two large chip testing and packaging factories owned by Freescale globally.
32. Hitech Semiconductor (Wuxi) Co., Ltd.
Main business: Hitech Semiconductor (Wuxi) was jointly invested by Taiji Industrial and SK Hynix in 2009, and has IC chip probe testing, packaging, packaging testing, module assembly, and testing services. The latest process reaches 20nm.
Website: http://home.hitechsemi.com/
33. Intel Products (Chengdu) Co., Ltd.
Main business: Intel Products (Chengdu) was established in 2003 and is one of Intel’s largest chip packaging testing centers in the world, as well as one of Intel’s three major wafer preprocessing factories globally. Half of Intel’s mobile device microprocessors come from Chengdu.
34. Shanghai Kaihong Technology Co., Ltd.
Main business: Shanghai Kaihong Technology was established in 1995 and is a wholly-owned subsidiary of DIC Electronics Co., Ltd. in the United States, mainly engaged in SMD components and integrated circuit products; semiconductor functional modules; multi-chip combination packaging; bare chip packaging; high-power device packaging.
35. SanDisk Semiconductor (Shanghai) Co., Ltd.
Main business: SanDisk Semiconductor (Shanghai) was established in 2006 and is SanDisk’s only fully functional assembly and testing factory. Main operations: design, research and development, testing, packaging, and production of new electronic components and products.
36. ScienTek Corp.
Main business: PDIP, HDIP, Qipai, SOP, ESOP, SSOP, TSSOP, MSOP, EMSOP, SOT, and TO series products, and continuously expanding mid-to-high-end products such as LQFP, QFN, DFN, SIP, etc.
Website: http://www.szscpc.com/
37. Jiangyin Suyang Electronics Co., Ltd.
Main business: focuses on high-performance, high-reliability medium and large power semiconductor discrete devices and multi-chip power management integrated circuits packaging and testing business.
Website: http://www.jysot.com/
38. Zhejiang Donghe Electronics Technology Co., Ltd.
Main business: a high-tech enterprise specializing in the packaging and testing services of electronic components, IC integrated circuits, and other electronic products.
39. Nanjing Siliconbond Semiconductor Co., Ltd.
Main business: focuses on providing packaging design, testing services, and other solutions for customers both domestically and internationally. The processes cover from wafer grinding, cutting to finished product packaging shipment. Currently, the products are mainly applied in LED drivers, power management, wireless RF power amplifiers, MEMS sensors, and fingerprint recognition.
Website: http://www.microbonding.cn/
40. Shanghai Xinzhe Microelectronics Technology Co., Ltd.
Main business: Shanghai Xinzhe is a high-tech enterprise engaged in integrated circuit R&D, design, processing, manufacturing, and providing one-stop technical services for domestic and foreign chip design companies and wafer manufacturers packaging testing.Main clients: BYD, Shanghai Huahong NEC, Shanghai Beiling, BCD, and overseas clients.
Website: http://www.simat-sh.com/
41. Shanghai Jiemin Co., Ltd.
Main business: world-class power semiconductor packaging and testing services.
Website: http://www.gemservices.com/
42. Shanghai Beixin Semiconductor Technology Co., Ltd.
Main business: provides fast and professional chip testing and analysis services for IC design companies, research institutes, and manufacturers, mainly including ceramic quick packaging (DIP, SOP, QFP, QFN, LCC, PGA, BGA, etc.), wafer mpw shuttle grinding, cutting, bare die picking, engineering sample quick packaging, ceramic tube customization, COB processing, packaging design, high-speed PCB design, packaging substrate process development, DEA technology development and research, SI/PI simulation, substrate and leadframe multi-chip SIP design and integration, and other technical services.
Website: http://www.ictek.com.cn/
43. Shanghai Genpai Semiconductor Technology Co., Ltd.
Main business: provides one-stop technical services including MPW/Shuttle rapid thinning, scribing, picking, packaging, testing development, and reliability testing. As the only company in China that can provide customers with 24-hour rapid thinning scribing and rapid molding service, it also provides fast packaging for COB, ceramic tubes, Driver IC, sensors, MEMS, RFID, etc., with the fastest delivery time of 1 to 4 hours.
45. Suzhou Shunyixin
Main business: Suzhou Shunyixin currently provides COB packaging and services for CMOS image sensors and other semiconductors, integrated circuit chips, including technical development, consulting, and transfer within the relevant technical fields, mainly engineering samples and mass production products PLCC and CLCC packaging, also provides specialized PLCC design and packaging services according to customer needs.
46. Suzhou Jiyuan Xinna Nano Technology Co., Ltd.
Main business: provides customized packaging design, prototype manufacturing, small batch trial production, and mass production packaging solutions for MEMS sensors and system integration micro-module products to design companies, solution providers, and research institutions.
Website: http://www.jyxsolution.com/
47. Taizhou Haitian Semiconductor Co., Ltd.
Main business: R&D, production, and sales of semiconductor crystal backend packaging, surface tin plating treatment of semiconductor transistors.
48. Taizhou Mingxin Microelectronics Co., Ltd.
Main business: specializes in the research, development, and manufacturing of semiconductor devices.
Website: http://www.china-mingxin.com/
49. Wuxi Hongguang Microelectronics Co., Ltd.
Main business: engaged in the packaging and testing of semiconductor discrete devices and integrated circuits, with a design capacity of TR/IC 500 million (pieces)/month.
Website: http://www.wxhgm.com/
50. Jiangsu Gelite Electronics Co., Ltd.
Main business: mainly engaged in IC integrated circuit chip R&D, production, packaging, testing, and sales.
Website: http://www.gelite.com/
51. Jiangsu Yanxin Microelectronics Co., Ltd.
Main business: a national high-tech integrated circuit manufacturing enterprise focused on semiconductor packaging and testing.
52. Jiangsu Huicheng Optoelectronics Co., Ltd.
Main business: the company engages in the packaging and testing services of display panel “driver IC” gold bumps, which is an important part of the flat panel display (LCD) industry chain. The project process includes four major parts: 1. Production of gold bumps; 2. Testing of integrated circuits; 3. Cutting of driver ICs; 4. Packaging of driver ICs. It is the first manufacturer in mainland China capable of providing a complete four-step process.
Website: http://www.unionsemicon.com.cn/
54. Foshan Blue Arrow Electronics Co., Ltd.
Main business: various packaged transistors, LEDs, MOSFETs, voltage regulator ICs, Schottky diodes, thyristors, and various LED lighting fixtures, backlight modules, etc.
Website: http://www.fsbrec.com/
55. Guangdong Fenghua Xindian Technology Co., Ltd.
Main business: a national high-tech enterprise specializing in the research, development, production, and sales of semiconductor discrete devices and integrated circuits.
Website: http://www.fenghua-semi.com/
56. Shenzhen Jinyu Semiconductor Co., Ltd.
Main business: mainly produces semiconductor discrete components, MOSFETs, and general integrated circuits. The main products include TO, SOD, SOT, SOP, TSSOP series.
Website: http://www.htsemi.com/
57. Shenzhen Shengyuan Semiconductor Co., Ltd.
Main business: semiconductor device packaging and testing enterprise. The main products include integrated circuits (IC), high reverse voltage power transistors (BJT), fast transistors (GAT), power MOSFETs, Schottky diodes (SBD), fast recovery diodes (FRD), thyristors (SCR), etc.
Website: http://www.sysemisz.com/
58. China Resources Semiconductor (Shenzhen) Co., Ltd.
Main business: established in June 2000, China Resources Semiconductor (Shenzhen) Co., Ltd. is a professional manufacturer engaged in wafer testing and finished IC testing services (wafer cutting, picking, and packaging) for digital and analog integrated circuits and discrete devices.
Website: http://www.crsmc.com/
59. Sichuan Mingtai Electronic Technology Co., Ltd.
Main business: dedicated to the research of new technologies and processes for integrated circuit packaging, successfully developed a thermal ultrasonic ball welding process using copper wire as the connection material and a multi-row array frame multi-chip packaging process. The company’s products have transitioned from ordinary DIP, SOP packaging to SSOP, TSSOP series.
Website: http://www.mountek-sc.com/
60. Chongqing Jialingxin
Main business: has more than ten packaging production lines, including T0 series, DO series, SOP series, DIP series, SMA, SMB, SMC, etc.; with an annual production of over 3 billion integrated circuits and discrete devices, can meet customers’ comprehensive device packaging requirements.
Website: http://www.jialingxin.com/
61. Beijing Yandong Microelectronics Co., Ltd.
Main business: specialized in the design, manufacturing, packaging, and sales of semiconductor microelectronic devices. Yandong’s products mainly involve two major application fields, namely the civilian field and special application field.
Website: http://www.ydme.com/
62. Shandong Diyiyi Electronic Technology Co., Ltd.
Main business: specialized in the research, development, production, and sales of semiconductor diodes, bridge rectifiers, thyristors, MOSFETs, solar photovoltaic components, etc., is a national high-tech enterprise and a well-known semiconductor electronic component manufacturer in China, as well as the largest MD bridge rectifier production base in the country.
Website: http://www.dyelec.com/
63. Shandong Hanqi Technology Co., Ltd.
Main business: has established mature and stable wafer processing, packaging, and testing cooperation channels. The company can package and test various ICs, including SOP08 series, SOP16 series, TSOP08 series, SOT123-6, DFN, QFN, CSP, etc.
Main clients: Molex (USA), Panasonic (Japan), ITM (Korea), ZTE, Huawei, Shanghai Huahong, DJI (Shenzhen), etc.
64. Shandong Taijixing Electronic Technology Co., Ltd.
Main business: focuses on advanced integrated circuit packaging and testing.
Website: http://www.tg-star.com/
65. Liaoyang Zehua Electronic Products Co., Ltd.
Main business: a professional manufacturer of transistors and integrated circuits.
Website: http://www.lyzhdz.com.cn/
66. Sino-American Joint Venture Dandong Xingang Electronics Co., Ltd.
Main business: specializes in producing high-frequency low-noise power transistors, field-effect transistors, medium and small power transistors, band-stop transistors, switching diodes, three-terminal voltage regulators, thyristors, energy-saving lamp tubes, etc., and can cooperate in the development of semiconductor discrete devices. The company has a complete range of packaging shapes and is currently one of the manufacturers in China with the most packaging shapes.
Website: http://www.ddxgdz.com/
Note: The ranking is not in order. If there are any omissions or errors, please point them out. Phone: 400-0933-666, Email: [email protected].
— END —
Related Articles:
The Current Status and Top Ten Trends of China’s Semiconductor Manufacturing Industry
The “Father of Graphene” Discovers a New Super Material: Will Semiconductors’ Future Be This?
Reprinted from WeChat Official Account ittbank. Editor: Mingxuan
*This article is a reprint. If there are any issues, please contact us for processing.
Main business: professional packaging and testing foundry.
Main business: a world-renowned leader in diode manufacturing.
Website: http://www.taijisemi.cn/
Website: http://www.gtbf-ltd.com/