01
With the continuous promotion of energy-saving and environmental protection policies, the construction of smart manufacturing is developing vigorously. In recent years, variable frequency speed control technology has been widely used in household appliances and industrial control fields.
The development of variable frequency technology has also brought about changes in the hardware circuit topology, with power devices becoming an indispensable core part, realizing functions such as rectification, PFC (or Brake), and inversion. In practical circuit design, integrated module products are prioritized to improve development efficiency, reduce the size of inverters, and enhance product performance.
Air Conditioning Compressor System Block Diagram
Universal Inverter System Block Diagram
02
To meet the integrated application needs of the variable frequency market, Xineng Semiconductor has the most complete domestic IPM product line and has recently launched the power module XNF40A92C6. This module integrates the rectifier bridge and PFC (or Brake) circuit, using DIP26 packaging, which is consistent in height with the DIP26 IPM XNS15S92F6, playing an important role in saving space and facilitating installation. The main functional features of the product are as follows:
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Built-in 600V/40 A RC-IGBT, single-phase boost power factor correction, including gate drive and complete protection functions
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Built-in full-wave bridge rectifier and high-performance output diode
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Comprehensively optimized IGBT gate drive, with a maximum frequency of up to 40KHz
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Built-in negative temperature coefficient thermistor for temperature detection
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The package uses an aluminum substrate for better heat dissipation and high customization
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Insulation level 2000Vrms/1min
Product Image
Schematic Diagram
03
All power semiconductor components in the variable frequency system (i.e., bridge rectifier, IGBT for PFC, boost diode, and IPM for motor drive) are usually installed on a heat sink for cooling. Among them, discrete device solutions occupy a large area of the heat sink and PCB, the assembly process is complex, protection functions are inadequate, and heat dissipation is poor.
The integrated power module + IPM solution from Xineng Semiconductor perfectly solves the above problems, greatly simplifying circuit design and heat dissipation design, and can well meet the design requirements of miniaturization and high performance for inverters.
Discrete Device Solution
Integrated Solution