
The industrial-grade chip model RK3506J under the RK3506 platform features -40 to 85℃ wide temperature performance, low heat generation, rich IO interfaces, high immediacy, low latency, and fast response speed. It is equipped with Rockchip’s industrial-specific SDK, making it suitable for industrial applications. Today, Tactile Intelligence will analyze the five major technical highlights of RK3506J.Industrial-Specific Design Interfaces

Low Latency, High Real-Time Performance
RK3506J supports an AMP multi-core heterogeneous architecture, allowing a single chip to support a flexible combination of Linux, RTOS, and Bare-metal. The system has a microsecond-level interrupt response latency (<5us) and uses the standard RPMsg inter-core communication mechanism.
Rockchip provides Preempt-RT or Xenomai real-time patches for Linux systems. Under stress-ng load testing conditions, the system scheduling real-time performance can achieve a latency of 60+us.

Lightweight UI Framework
Low Power Consumption, Longer Battery Life
Multi-System Support
The RK3506J SDK supports Linux Kernel 6.1, providing support for Buildroot and Yocto systems, while also supporting AMP multi-core heterogeneous systems. It is the first to achieve RTOS SMP mode on Rockchip’s multi-core architecture, adding support for multi-core scheduling in the implementation system.
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