In the context of rapid iteration of smart audio devices and the deep empowerment of edge computing technology, wireless microphone chips continue to evolve towards ultra-low power consumption, high integration, intelligent noise reduction, and high-speed wireless transmission.
Recently,Actt(Actt) developed aBluetooth RF IP based on a22nm process platform, which has been successfully applied in themain control chip of internationally renowned manufacturers of smart noise-canceling clip-on microphone products, and has successfullygone into mass production.
The launch of this terminal product not only marks the international market recognition of Actt’s high-performance RF IP technology and services but also highlights the company’s core value in accelerating customer chip design, enhancing integration, and shortening mass production cycles, setting a benchmark for the application of domestic wireless microphone chip RF IP technology.
Exceptional IP Performance Builds Core Competitiveness of Wireless Audio Chips
Actt provides RF IP solutions coveringBluetooth 5.2,Bluetooth 5.4, andBluetooth 6.0 standards, meeting the needs of a wide range of fields from basic audio transmission to the new generation of low-power audio (LE Audio), high-precision positioning services, and ultra-high-speed data transmission.The Bluetooth 5.2 RF IP that has gone into mass production is based on a 22nm platform process, and its design has been deeply optimized for high-performance, low-power audio chips.
Highly Integrated, Simplifying Design Complexity
Using a single-ended antenna architecture and integrating an internal matching network, it significantly reduces the number of external components (BOM) and design complexity.
The analog hard IP area is < 0.7mm², and the digital soft IP logic gate scale is < 200K Gates, combined with a minimal mask layer and IO pins, significantly improves SoC area utilization, helping to greatly reduce chip area.
Ultra-Low Power, Empowering Long Battery Life
Fully leveraging process characteristics, even in high-sensitivity mode and at a 1Mbps rate in receive mode (RX), it can maintain ultra-low power operation, greatly extending product battery life.
Exceptional RF Performance Ensures Connection Reliability
Excellent RX Noise Figure ensures clear communication over long distances in complex wireless environments, with stable anti-interference capabilities.
A wide junction temperature range of -40℃ to 125℃ provides excellent environmental adaptability and reliability for the product.
Integrated ESD protected I/O pads meet the stringent requirements of terminal application scenarios.
One-Stop Comprehensive Solutions Accelerate Design Integration
Actt, as a platform-based “one-stop” IP solution provider, offers a comprehensive IP combination based on the same process node for the mass-produced wireless microphone main control chip, covering high-performance RF IP, PMU (Power Management Unit) IP, and I/O IP. This complete“RF+PMU+I/O solution” effectively simplifies customer design through high synergy between IPs, significantly shortens integration cycles, and reduces overall risk.
Faced with the increasingly stringent demands ofwireless microphone chips for high-definition audio quality, intelligent noise reduction, low-latency wireless transmission, and real-time voice recognition/transcription/summary, Actt’s Bluetooth RF IP, with its ultra-low power consumption, ultra-high integration, exceptional RF performance, and comprehensive supporting solutions, will become a trusted choice for chip design manufacturers to create differentiated competitive advantages and achieve rapid productization.The successful application and mass production on the smart noise-canceling clip-on microphone chips of leading international manufacturers is an intuitive certification of the market and technology for the Actt brand.
Actt continues to delve into the field of IP technology and design services, committed to providing industry partners with high-reliability, high-integration, and high-performance IP platform solutions, building an efficient and win-win technical cooperation bridge. In the era of the wave of intelligent and miniaturized wireless audio, Actt will empower chip design partners with innovative IP technology and professional services, jointly promoting the innovation of smart audio experiences, making clear, stable, and free wireless sound ubiquitous, and defining the RF architecture standards for the next generation of wireless audio chips together with the industry.
About Actt
Chengdu Actt Microelectronics Technology Co., Ltd. (referred to as: Actt) was established in 2011 and is a national-level “specialized, refined, distinctive, and innovative” high-tech enterprise engaged in integrated circuit intellectual property (IP) product design, licensing, and providing chip customization services. The company is based on low-power technology and has gradually developed and constructed a product pattern centered on analog and mixed-signal IP, embedded storage IP, wireless RF communication IP, and wired connection interface IP, holding over 150 domestic and international patents. It has established partnerships with over 30 global wafer fabs, covering various process platforms such as CMOS, FinFET, eFlash, BCD, HV, SiGe, and FD-SOI, promoting over 1000 IPs, and serving hundreds of integrated circuit design companies worldwide, with products widely used in automotive electronics, industrial control, IoT, wireless communication, and edge computing fields.
Actt is always committed to providing excellent products and services to partners, adhering to the value concept of integrity, responsibility, cooperation, and win-win, and striving to become a trusted world-class integrated circuit IP provider.
