Company Research | Xiyeg股份: AI Computing Power Demand Drives AI Hardware Iteration, Utilizing Multi-GPU Architecture and High-Density Multi-Layer PCBs, Expected to Increase Tin Usage per Device Significantly Compared to Traditional Equipment
Xiyeg股份November 14On-site Research Content: Company OverviewXiyeg股份 has an integrated industrial pattern encompassing the exploration, selection, smelting, deep processing, and new material research and trade of non-ferrous metal resources such as tin, indium, zinc, and copper. Its main products include tin ingots, cathode copper, zinc ingots, and indium ingots. An important equity holding, Yunnan Tin New … Read more