In recent years, the trend of lightweight laptops has become significant. However, for consumers who require high performance from their laptops, ultra-thin models are not the optimal choice. The reason is that achieving extreme thinness often requires compromises in cooling, battery capacity, etc., which subsequently affects the choice of processors, battery life, and performance release.

How to balance performance, cooling, and battery life in lightweight laptops is a challenge. In terms of cooling, fanless designs are one approach being attempted, with mainstream laptop brands like Lenovo, DELL, HP, APPLE, Microsoft, and Huawei all releasing related products.

Image of the fanless design M1 MacBook Air, photo from the laptop evaluation room

The fanless design can offer several benefits:

0 noise;
Allows for lightweight design;
Internal space can accommodate larger batteries and memory, enhancing battery life;
Good sealing reduces dust impact on laptop performance.

However, current technology means that fanless cooling designs typically use low-power processors, which compromises performance. To create a high-performance fanless laptop, further technological advancements are necessary. In the 2021 German iF Design Award concept category, there was a fanless laptop design that operates at a 15W TDP without throttling or overheating, let’s take a look at it.

Inventec’s Fanless Laptop

According to images from the German iF official website:

Inventec has launched the world’s best fanless laptop after two years of breakthroughs, making its functionality four times more powerful than any other laptop on the market. This completely silent laptop can reduce device failure rates by 30% and extend battery life by 125%, making it suitable for any server environment. The fanless system provides a quieter environment, zero anxiety, and greater flexibility for internal component placement.

In each generation of Intel U-series CPUs, TDP (Thermal Design Power) is typically set at 15W. To achieve this, the cooling modules in traditional fanless laptops are usually installed at the base of the laptop, dissipating heat to the surface; thus, thermal performance is limited by the size of its chamber, and due to the inefficiency of cooling surface temperature, the CPU throttles, which is why they cannot achieve the 15W TDP.

Innovative Fanless Laptop Design by Inventec

Inventec’s unique fanless design overcomes the difficulty of placing two heat pipes that pass through the hinge cover on the back of the display, managing to move the heat pipes with the hinge, thus allowing heat to be dissipated to the back of the display while ensuring durability.

This innovative solution is the key technology of the world’s first and only fanless laptop, allowing it to achieve a 15W TDP without throttling or overheating.

Inventec’s solution employs a unique heat pipe design, conducting heat from the chassis through a special heat module placed under a hinge cover, distributing heat to the top surface.

Moreover, the hinge of Inventec’s 15W fanless laptop has a lifespan exceeding 30,000 cycles, which is more durable than the standards of the top five market brands.

At the same time, the surface temperature is lower than the market standard by about 3℃.

Inventec’s fanless laptops have several advantages:

1. No fan noise

Fan noise can cause dizziness, headaches, tinnitus, distraction, and reduced work efficiency;

2. Good protection

Without ventilation holes, users no longer have to worry about blockages and can prevent external substances from entering the chassis, protecting the internals from various factors in harsh environments.

3. Better durability

Based on big data from Inventec’s 30 years of experience in the laptop field, our conclusion is that the failure rate of fanless designs will be reduced by 30%.

4. Enhanced design flexibility

The fanless design can save up to 7200mm2 of chassis area, which can be replaced with a battery that has a lifespan increased by 125%; or a traditional SSD; or a 10% increase in speaker volume.

Some sources:

https://ifworlddesignguide.com/,

Compiled by Ai Bang Gao Fen Zi Ai Shuai Shuai

Laptop innovation will accelerate in the coming years. What materials and processes will emerge? How will processing manufacturers prepare? The Ai Bang laptop innovation material exchange group currently includes Lenovo, Xiaomi, Dell, ASUS, Victory Precision, Inventec, Wistron, Compal, and other companies. Scan the QR code to join.

Recommended reading:

5G mobile phones and laptops: cooling is key, cooling materials welcome new business opportunities
Dell Alienware teases new cooling solutions for the X series gaming laptops
Apple iPhone may adopt Mac Pro “cheese grater” lattice design to enhance cooling capacity
5G cooling demand is strong, VC phase change plates welcome new market for mobile phones

Event Recommendation: Invitation: The 3rd Laptop Material Innovation Summit – New Equipment, New Processes, Intelligent Manufacturing (Chongqing, October 27)

The 3rd Laptop Material Innovation Summit

– New Equipment, New Processes, Intelligent Manufacturing

October 27, 2021 (Wednesday)

Jinling Grand Hotel

(99 Chunhua Avenue, Yubei District, near Jiangbei International Airport)

1. Conference Topics (including but not limited to):

Serial Number	Topic	Speaker Unit
1	Laptop CMF Design	Invited Compal/HP/Acer
2	Gaming Laptop CMF Innovation Trends	ASUS Huang Shengjie, Greater China CMF Director
3	Application of Magnesium Sheet Stamping & Surface Treatment in Lightweight Laptops	Chongqing Daitai Zhang Shixiang, Vice President
4	SABIC Special Materials Environmental Innovation Materials Support Laptop Development	SABIC Wu Xiaozhi, Business Development Manager
5	Progress of Magnesium-Lithium Alloy Die Casting Applications in Laptops	Si Fang Ultra Light Wang Rui, Technical Vice President
6	Application of Bio-based TPU in Laptops	Lubrizol Liu Shengliang
7	Intelligent Equipment Solutions for Processing New Material Structural Parts in Laptops	Jiu Jiu Precision Zheng Lin, Assistant to the Chairman
8	Automated Testing and Assembly Production Lines for Laptops	Invited Malu Technology
9	Innovative Environmental Coating Solutions for Laptops	Invited Chongqing Aibang
10	Prospects for Intelligent Manufacturing in the Laptop Industry	Invited Inventec
11	Advantages and Progress of High-strength Titanium Alloys in Laptops	Invited Xiangtou Jintian Titanium Alloy
12	Application of Laser Texture Technology in Laptop Processing	Invited Ru Xin Laser/GF/Rui Tao Optoelectronics
13	Application of Composite Materials in Laptops	Invited Covestro/Toray/Ausm
14	Magnesium Alloy Semi-solid Injection Molding Technology and Equipment	Invited Ju Bao/Kecheng/Yi An Technology/Shengshida
15	Application and Surface Treatment of Glass in Laptops	Invited Wancheng Technology
16	Hinge Design for Lightweight Laptops	Invited Kunshan Weishuo

For more innovative topic speaking intentions, please contact Miss Zhou: 18320865613 (same WeChat)

2. Registration Method:

Method 1: Online Registration

Registration link:

https://www.aibang360.com/m/100091

(You can also click this link or copy it to the browser to register)

Method 2: Please add WeChat and send a business card to register

Ai Guoguo: 133 1291 7301;

[email protected]

Miss Zhou: 183 2086 5613;

Note: Each participant must provide their information

Read the original text, register online

Innovative Fanless Laptop Design by Inventec

Inventec’s Fanless Laptop

The 3rd Laptop Material Innovation Summit

1. Conference Topics (including but not limited to):

2. Registration Method:

Understanding the Relationship Between Micro:bit and Arduino

Getting Started with the Arduino ESP32 Core Library

Implementing Neural Networks on a 10-Cent RISC-V MCU Without a Multiplier

Getting Started with Arduino: Light Up Your First LED from Scratch

How Highly Integrated Embedded Processors Drive the Development of Industrial Robots

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