Recently, ARM released the new generation flagship high-end CPU Cortex-A73, with a 10nm FinFET process that has an area of less than 0.65 square millimeters, and a frequency of up to 2.8GHz. The peak performance and sustained performance can be improved by up to 30% compared to A72. Companies such as Huawei HiSilicon, Samsung Electronics, MediaTek, and Marvell have already signed licenses.

ARM has repeatedly stated that the 10nm process is the best partner for the A73 core. However, whether it is TSMC or Samsung, the new process will not be fully mature until next year, and completing the 10nm A73 processor will take until the end of next year.

To this end, ARM has also collaborated with TSMC to deeply optimize the new core for the 16nm process.

Currently, ARM Artisan physical IP, including POP IP, has been launched, targeting mainstream mobile system chips (SoCs) based on the A73 processor and TSMC’s 16FFC (16nm FinFET Compact) process.

ARM states that the third-generation Artisan FinFET platform has been optimized for TSMC’s 16FFC process, helping ARM SoC partners adopt the most energy-efficient and high-performance A73 for designing mobile and other consumer applications, while meeting the price demands of the mass market.

The first TSMC 16FFC test chip equipped with A73 POP IP was successfully taped out in early May 2016, allowing partners to quickly verify the key performance and power consumption metrics of new products.

This means that, in addition to the future high-end 10nm A73 processor, chip manufacturers can also quickly create mainstream 16nm A73 processors, improving cost performance to meet the mid-range market.

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