Chris Bergey, Senior Vice President and General Manager of Arm’s Client Products Division, recently attended a media event in Beijing, where he stated that Arm’s next-generation flagship CPU IP “Travis” will achieve a double-digit percentage IPC improvement over the existing Cortex-X925.“Travis” is set to launch later this year, and it will also be the first generation of public CPU IP supporting Armv9 SME scalable matrix extension instructions, which can enhance AI workload processing rates; concurrently, the “Drage” GPU will support Arm ASR super-resolution technology.
1. Edge Side: Predicted PC and Tablet Shipment Ratio to Exceed 40% This Year
Meanwhile, Arm’s CPU market share in edge computing continues to rise, expected to account for over 40% of the overall shipment volume in the PC and tablet sectors by 2025. Notably, NVIDIA’s recently launched DGX Spark AI desktop computing platform utilizes Arm’s latest Cortex-X925 and Cortex-A725 cores, equipped with a GPU capable of achieving up to 1 PetaFLOPs AI performance, enabling desktop devices to achieve data center-level computing capabilities.2. Cloud Side: Nearly 50% of Leading Cloud Service Computing Power Expected to be Based on Arm Architecture This Year Arm has transformed into a computing platform company, demonstrating leadership in computing efficiency and energy efficiency across various applications from cloud to edge.
In the cloud and data center sectors, tech giants like Amazon Web Services (AWS), Google, and Microsoft are continuously expanding their self-developed data center chips based on Arm computing platforms.Arm expects that by 2025, nearly50% of the computing power shipped to leading hyperscale cloud service providers will be based on Arm architecture..
New Generation Flagship CPU Launching This Year with Double-Digit IPC Performance Improvement Last year, Arm launched a new generation of flagship computing platforms, including the Cortex-X925, which is based on the Armv9.2 architecture, achieving a record IPC performance increase of 15%, significantly enhancing the capabilities of high-performance mobile SoCs. MediaTek’s Dimensity 9400 supports ArmV9.2 architecture, adopting a “1+3+4” tri-cluster architecture, including 1 Cortex-X925 (Armv9.2 super core) + 3 Cortex-X4 cores + 4 Cortex-A720 (Armv9.2 efficiency cores). Both Cortex-X925 and Cortex-A720 are core designs of the Armv9.2 architecture, focusing on performance and energy efficiency optimization. Cortex-X925 improves performance by 36% and AI computing capability by 46% compared to the previous generation Cortex-X4. Additionally, a recent leak referred to “Travis” as “X930”; both “Travis” and “Drage” will be part of MediaTek’s Dimensity 9500 mobile platform.
| Dimensity 9500 | ||
|
Application Processor |
Feature | Description |
| APU | New generation APU (APU 9.0) | |
| AP MCU |
1*Cortex-X930(Travis,4.0GHz+)+3*Cortex-X9系 (Alto,3.5GHz)+4*Cortex-A7系 (Gelas,2.8GHz) |
|
| GPU | Immortalis-Drage(New microarchitecture, 16 cores) | |
| Clock Speed | 3.5GHz+ | |
| Memory | EMI | LPDDR5X 10667Mbps(4 channels) |
| UFS | UFS4.1(4-Lane) | |
| AnTuTu Score | Targeting over 4 million (V10 version) | |
| Process and Package | TSMC N3E process(3nm Enhanced) |
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New Move Technology
Leading IoT Solution Provider
About New Move Technology Co., Ltd.
Shenzhen New Move Technology Co., Ltd. is a leading provider of mobile communication technology and IoT solutions, integrating technology research and development, product manufacturing, system integration, and product sales as a national high-tech enterprise and a national specialized and innovative enterprise.
The company established an SMT manufacturing subsidiary in 2018, with professional production equipment and modern production workshops, providing strong support for the production of core modules and customer-customized PCBA projects, offering a full range of services from R&D to manufacturing.
Headquartered in Bao’an, Shenzhen, with a research and development center in Changsha, we focus on mobile communication technology (2G/3G/4G/5G) and Android smart IoT technology (Android, IoT).
Based on years of technical reserves and resource accumulation in the communication field, the company has established comprehensive strategic partnerships with globally renowned mobile chip manufacturers such as MediaTek (MTK), Unisoc, and Qualcomm, receiving strong technical support from chip manufacturers. We closely follow the pace of major mobile chip manufacturers, continuously launching powerful Android communication modules, thereby providing customers with stable, reliable, and high-performance smart IoT hardware platforms. We offer comprehensive technical support covering the entire process from R&D, manufacturing, to supply chain, providing strong support for customers to quickly launch products. Successfully developed Android mainboards based on MediaTek, Unisoc, Qualcomm platforms have been widely used in smart handheld terminals, POS machines, advertising machines, robots, smart homes, industrial control, vehicle navigation, security monitoring, mobile medical, education and training, and IoT-related fields.
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Headquarters: 4th Floor, Jin Yuan Business Building A, No. 300 Xixiang Avenue, Bao’an District, Shenzhen
Customer Hotline: Mr. Liu, phone and WeChat same number 18688981861
