Fraud Case Involving Circuit Board Damage for Product Returns Concluded!

Fraud Case Involving Circuit Board Damage for Product Returns Concluded!

To alleviate the inventory pressure caused by returns of electronic products, Du and Wang devised a scheme to deliberately damage product circuit boards by applying high current, burning out components, and then claiming “quality issues” to exchange for new products, thereby committing fraud. Recently, the Haidian Court sentenced defendants Du and Wang to three years … Read more

Low Loss Design and Manufacturing of Flexible Circuit Boards by Pengding

Low Loss Design and Manufacturing of Flexible Circuit Boards by Pengding

Pengding Holdings has disclosed a flexible circuit board and its manufacturing method. The core innovation of this circuit board lies in the adoption of a unique dielectric structure, which uses air filled in a closed cavity as the primary medium surrounding the signal transmission lines. Compared to traditional dielectric materials, air has a lower dielectric … Read more

Guide to the Structure and Manufacturing Methods of Flexible Circuit Boards

Guide to the Structure and Manufacturing Methods of Flexible Circuit Boards

Guide to Flexible Circuit Boards and Their Manufacturing Methods Overview This guide aims to help you review and understand the structure of flexible circuit boards and their manufacturing methods as described. The patent discloses a design for flexible circuit boards intended to reduce high-frequency signal transmission losses by introducing air-filled sealed cavities to minimize dielectric … Read more

Innovative Circuit Board with Solder Pads and Its Manufacturing Method

Innovative Circuit Board with Solder Pads and Its Manufacturing Method

Core Issues and Technical Background: Pengding Holdings addresses the trend of existing electronic products moving towards being thinner, lighter, and smarter, where flexible circuit boards (FPC) are widely used as important components. To achieve high frequency, high speed, thinness, and dense routing, as well as to meet the requirements of Ball Grid Array (BGA) packaging, … Read more

3D Printing of Circuit Boards

3D Printing of Circuit Boards

The process of 3D printing circuit boards typically involves the following two main methods, detailed as follows: Method 1: Directly Printing Circuits with Conductive Materials Designing the CircuitUse specialized circuit design software, such as EAGLE or Fusion 360, to design and model the circuit. Once the design is complete, import the circuit board file into … Read more

Research Guide on High-Frequency Copper Clad Laminates and Their Preparation Methods, Circuit Boards, and Electronic Devices

Research Guide on High-Frequency Copper Clad Laminates and Their Preparation Methods, Circuit Boards, and Electronic Devices

The structural composition of the new copper clad laminate and its differences from traditional copper clad laminates. How the design of this copper clad laminate balances structural reliability and signal loss. The impact of different material selections on the performance of copper clad laminates. The preparation methods for copper clad laminates. Circuit boards made from … Read more

What to Do and What Not to Do When Designing 3D Flexible Circuit Boards

What to Do and What Not to Do When Designing 3D Flexible Circuit Boards

As consumer electronics continue to miniaturize and become lighter, the application of 3D flexible circuit boards is becoming increasingly widespread, making it a key focus for engineers. This article will outline important considerations for designing 3D flexible circuit boards, hoping to assist fellow engineers. 1. Preparation Before DesignDetailed documentation is crucial for planning key areas … Read more